Crack propagation in multilayer thin-film structures of electronic packages using the peridynamic theory

A. Agwai, I. Guven, E. Madenci

Research output: Contribution to journalArticle

13 Scopus citations

Abstract

This paper presents an application of the peridynamic theory to predict crack paths in multilayer thin-film structures of electronic packages. The peridynamic theory is a nonlocal continuum theory that has an inherent crack initiation and growth criterion. Specifically, the peridynamic theory is employed to model cross-sectional nanoindentation, an experimental technique used for characterizing interfacial adhesion and observing crack paths. Cross-sectional indentation experiments previously conducted on blanket and patterned thin-film structures were simulated. The predicted crack propagation paths in both blanket and patterned multilayer thin-film structures compare well with the results from cross-sectional nanoindentation experiments.

Original languageEnglish (US)
Pages (from-to)2298-2305
Number of pages8
JournalMicroelectronics Reliability
Volume51
Issue number12
DOIs
StatePublished - Dec 1 2011

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Atomic and Molecular Physics, and Optics
  • Safety, Risk, Reliability and Quality
  • Condensed Matter Physics
  • Surfaces, Coatings and Films
  • Electrical and Electronic Engineering

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