Crack propagation in multilayer thin-film structures of electronic packages using the peridynamic theory

A. Agwai, I. Guven, Erdogan Madenci

Research output: Contribution to journalArticle

12 Citations (Scopus)

Abstract

This paper presents an application of the peridynamic theory to predict crack paths in multilayer thin-film structures of electronic packages. The peridynamic theory is a nonlocal continuum theory that has an inherent crack initiation and growth criterion. Specifically, the peridynamic theory is employed to model cross-sectional nanoindentation, an experimental technique used for characterizing interfacial adhesion and observing crack paths. Cross-sectional indentation experiments previously conducted on blanket and patterned thin-film structures were simulated. The predicted crack propagation paths in both blanket and patterned multilayer thin-film structures compare well with the results from cross-sectional nanoindentation experiments.

Original languageEnglish (US)
Pages (from-to)2298-2305
Number of pages8
JournalMicroelectronics Reliability
Volume51
Issue number12
DOIs
StatePublished - Dec 2011

Fingerprint

Multilayer films
crack propagation
Crack propagation
blankets
Nanoindentation
nanoindentation
Thin films
cracks
thin films
electronics
Cracks
crack initiation
indentation
Indentation
Crack initiation
adhesion
Adhesion
Experiments
continuums

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Surfaces, Coatings and Films
  • Atomic and Molecular Physics, and Optics
  • Condensed Matter Physics
  • Safety, Risk, Reliability and Quality

Cite this

Crack propagation in multilayer thin-film structures of electronic packages using the peridynamic theory. / Agwai, A.; Guven, I.; Madenci, Erdogan.

In: Microelectronics Reliability, Vol. 51, No. 12, 12.2011, p. 2298-2305.

Research output: Contribution to journalArticle

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