Current issues and future trends in CMP consumables for oxide and metal polish

M. Moinpour, Ara Philipossian

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The recent advent of Chemical Mechanical Planarization (CMP) as a major process technology has a significant impact on the semiconductor industry. Oxide CMP is a technology enabler for logic and dynamic random access storage (DRAM) devices with feature sizes less than or equal to 0.75 micrometer. A unique feature of the CMP module, is that pads and slurries have complex interactions with one another as well as with various components of the polishing equipment, process and wafer product set. This has led to the development of consumables formulated specifically to provide optimum performance for a given equipment and integrated circuit product-set.

Original languageEnglish (US)
Title of host publicationMaterials Research Society Symposium - Proceedings
EditorsS. Coffa, A. Polman, R.N. Schwartz
PublisherMaterials Research Society
Pages243-249
Number of pages7
Volume427
StatePublished - 1996
Externally publishedYes
EventProceedings of the 1996 MRS Spring Symposium - San Francisco, CA, USA
Duration: Apr 8 1996Apr 12 1996

Other

OtherProceedings of the 1996 MRS Spring Symposium
CitySan Francisco, CA, USA
Period4/8/964/12/96

Fingerprint

Industrial Oils
Chemical mechanical polishing
Oxides
Dynamic random access storage
Metals
Slurries
Polishing
Integrated circuits
Semiconductor materials
Industry

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials

Cite this

Moinpour, M., & Philipossian, A. (1996). Current issues and future trends in CMP consumables for oxide and metal polish. In S. Coffa, A. Polman, & R. N. Schwartz (Eds.), Materials Research Society Symposium - Proceedings (Vol. 427, pp. 243-249). Materials Research Society.

Current issues and future trends in CMP consumables for oxide and metal polish. / Moinpour, M.; Philipossian, Ara.

Materials Research Society Symposium - Proceedings. ed. / S. Coffa; A. Polman; R.N. Schwartz. Vol. 427 Materials Research Society, 1996. p. 243-249.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Moinpour, M & Philipossian, A 1996, Current issues and future trends in CMP consumables for oxide and metal polish. in S Coffa, A Polman & RN Schwartz (eds), Materials Research Society Symposium - Proceedings. vol. 427, Materials Research Society, pp. 243-249, Proceedings of the 1996 MRS Spring Symposium, San Francisco, CA, USA, 4/8/96.
Moinpour M, Philipossian A. Current issues and future trends in CMP consumables for oxide and metal polish. In Coffa S, Polman A, Schwartz RN, editors, Materials Research Society Symposium - Proceedings. Vol. 427. Materials Research Society. 1996. p. 243-249
Moinpour, M. ; Philipossian, Ara. / Current issues and future trends in CMP consumables for oxide and metal polish. Materials Research Society Symposium - Proceedings. editor / S. Coffa ; A. Polman ; R.N. Schwartz. Vol. 427 Materials Research Society, 1996. pp. 243-249
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