Current issues and future trends in CMP consumables for oxide and metal polish

M. Moinpour, A. Philipossian

Research output: Contribution to journalConference article

Abstract

The recent advent of Chemical Mechanical Planarization (CMP) as a major process technology has a significant impact on the semiconductor industry. Oxide CMP is a technology enabler for logic and dynamic random access storage (DRAM) devices with feature sizes less than or equal to 0.75 micrometer. A unique feature of the CMP module, is that pads and slurries have complex interactions with one another as well as with various components of the polishing equipment, process and wafer product set. This has led to the development of consumables formulated specifically to provide optimum performance for a given equipment and integrated circuit product-set.

Original languageEnglish (US)
Pages (from-to)243-249
Number of pages7
JournalMaterials Research Society Symposium - Proceedings
Volume427
StatePublished - Dec 1 1996
Externally publishedYes
EventProceedings of the 1996 MRS Spring Symposium - San Francisco, CA, USA
Duration: Apr 8 1996Apr 12 1996

    Fingerprint

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

Cite this