Damage prediction for electronic package drop test using finite element method and peridynamic theory

Abigail Agwai, Ibrahim Guven, Erdogan Madenci

Research output: Chapter in Book/Report/Conference proceedingConference contribution

15 Scopus citations

Abstract

Finite element method and peridynamic theory are coupled via submodeling approach to investigate the dynamic response and damage in an electronic package subjected to impact loading arising from drop-shock. The global modeling is performed using the finite element method while the peridynamic theory is employed for the submodeling and failure prediction. The analysis yielded the outermost solder joint as the critical joint with failure at the interface between the solder and copper pad on the PCB side.

Original languageEnglish (US)
Title of host publication2009 Proceedings 59th Electronic Components and Technology Conference, ECTC 2009
Pages565-569
Number of pages5
DOIs
StatePublished - Oct 12 2009
Event2009 59th Electronic Components and Technology Conference, ECTC 2009 - San Diego, CA, United States
Duration: May 26 2009May 29 2009

Publication series

NameProceedings - Electronic Components and Technology Conference
ISSN (Print)0569-5503

Other

Other2009 59th Electronic Components and Technology Conference, ECTC 2009
CountryUnited States
CitySan Diego, CA
Period5/26/095/29/09

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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    Agwai, A., Guven, I., & Madenci, E. (2009). Damage prediction for electronic package drop test using finite element method and peridynamic theory. In 2009 Proceedings 59th Electronic Components and Technology Conference, ECTC 2009 (pp. 565-569). [5074069] (Proceedings - Electronic Components and Technology Conference). https://doi.org/10.1109/ECTC.2009.5074069