Damage prediction in graphene thermoplastics for potential electronic packaging applications

Erkan Oterkus, Erdogan Madenci

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Scopus citations

Abstract

Graphene is a promising material for electronics industry due to its unique mechanical and electronic properties. In this study, the failure analysis of the graphene sheets is performed by using Peridynamic theory due to its unique capability in failure prediction at the continuum level and the similarity of its mathematical structure to the molecular dynamic simulations (MDS). The current approach is validated against MDS predictions by considering zig-zag and armchair type single layer graphene sheets with an initial edge notch subjected to tension loading. Finally, a similar analysis is performed for multi-layered graphene layers which are either commensurate or incommensurate to investigate the effect of number of zigzag and armchair type graphene sheets and their stacking sequence on failure modes.

Original languageEnglish (US)
Title of host publication2011 IEEE 61st Electronic Components and Technology Conference, ECTC 2011
Pages2134-2140
Number of pages7
DOIs
StatePublished - Jul 21 2011
Event2011 61st Electronic Components and Technology Conference, ECTC 2011 - Lake Buena Vista, FL, United States
Duration: May 31 2011Jun 3 2011

Publication series

NameProceedings - Electronic Components and Technology Conference
ISSN (Print)0569-5503

Other

Other2011 61st Electronic Components and Technology Conference, ECTC 2011
CountryUnited States
CityLake Buena Vista, FL
Period5/31/116/3/11

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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  • Cite this

    Oterkus, E., & Madenci, E. (2011). Damage prediction in graphene thermoplastics for potential electronic packaging applications. In 2011 IEEE 61st Electronic Components and Technology Conference, ECTC 2011 (pp. 2134-2140). [5898814] (Proceedings - Electronic Components and Technology Conference). https://doi.org/10.1109/ECTC.2011.5898814