Design and characterization of inertia-activated electrical micro-switches fabricated and packaged using low-temperature photoresist molded metal-electroplating technology

Wei Ma, Yitshak Zohar, Man Wong

Research output: Contribution to journalArticle

43 Scopus citations

Abstract

Inertia-activated electrical switches have been designed and realized using a low-temperature photoresist molded metal-electroplating micro-fabrication technology compatible with processed substrates containing micro-electronic signal-processing circuits. Packaging of the switches has also been implemented using this low-temperature plating process. A simple but accurate lumped spring-mass model is developed based on analytical and numerical analyses. Predictions of the behavior of switches with a range of different designs have been verified using both drop-hammer and shaker tests. With the application of an anti-stiction hydrophobic coating, susceptibility to stiction-induced storage and operational failure has been reduced. Unencapsulated switches making over 50 million contacts have been demonstrated at room ambient.

Original languageEnglish (US)
Pages (from-to)892-899
Number of pages8
JournalJournal of Micromechanics and Microengineering
Volume13
Issue number6
DOIs
StatePublished - Nov 1 2003
Externally publishedYes

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Mechanics of Materials
  • Mechanical Engineering
  • Electrical and Electronic Engineering

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