Design and characterization of inertia-activated electrical micro-switches fabricated and packaged using low-temperature photoresist molded metal-electroplating technology

Wei Ma, Yitshak Zohar, Man Wong

Research output: Contribution to journalArticle

41 Citations (Scopus)

Abstract

Inertia-activated electrical switches have been designed and realized using a low-temperature photoresist molded metal-electroplating micro-fabrication technology compatible with processed substrates containing micro-electronic signal-processing circuits. Packaging of the switches has also been implemented using this low-temperature plating process. A simple but accurate lumped spring-mass model is developed based on analytical and numerical analyses. Predictions of the behavior of switches with a range of different designs have been verified using both drop-hammer and shaker tests. With the application of an anti-stiction hydrophobic coating, susceptibility to stiction-induced storage and operational failure has been reduced. Unencapsulated switches making over 50 million contacts have been demonstrated at room ambient.

Original languageEnglish (US)
Pages (from-to)892-899
Number of pages8
JournalJournal of Micromechanics and Microengineering
Volume13
Issue number6
DOIs
StatePublished - Nov 2003
Externally publishedYes

Fingerprint

electroplating
Electroplating
Photoresists
photoresists
inertia
switches
Metals
Switches
stiction
Stiction
metals
hammers
Temperature
Hammers
Microfabrication
plating
Plating
packaging
microelectronics
Microelectronics

ASJC Scopus subject areas

  • Instrumentation
  • Materials Science(all)
  • Mechanics of Materials
  • Computational Mechanics

Cite this

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