Design and packaging of small 60 GHz antenna array for multi-chip communication

Ho Hsin Yeh, Kathleen L. Melde, William R. Eisenstadt

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Scopus citations

Abstract

In this paper, the design of a directive two-antenna 60 GHz array for chip-to-chip communications is proposed. The small array is used to improve the wireless link budget. The antenna system is designed in a package (AiP) which could be placed on the top of a silicon substrate. The analysis of the radiated fields, the packagine integration the feeding circuits are discussed in this paper. With proper design considerations, this 60 GHz antenna system demonstrates improved horizontal transmission capability and wireless link efficiency.

Original languageEnglish (US)
Title of host publication2012 IEEE International Conference on Wireless Information Technology and Systems, ICWITS 2012
DOIs
StatePublished - Dec 1 2012
Event2012 IEEE International Conference on Wireless Information Technology and Systems, ICWITS 2012 - Maui, HI, United States
Duration: Nov 11 2012Nov 16 2012

Publication series

Name2012 IEEE International Conference on Wireless Information Technology and Systems, ICWITS 2012

Other

Other2012 IEEE International Conference on Wireless Information Technology and Systems, ICWITS 2012
CountryUnited States
CityMaui, HI
Period11/11/1211/16/12

Keywords

  • antenna feeding
  • antenna in package (AiP)
  • antenna radiation patterns
  • communication in multi-chip module

ASJC Scopus subject areas

  • Computer Networks and Communications
  • Information Systems

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    Yeh, H. H., Melde, K. L., & Eisenstadt, W. R. (2012). Design and packaging of small 60 GHz antenna array for multi-chip communication. In 2012 IEEE International Conference on Wireless Information Technology and Systems, ICWITS 2012 [6417762] (2012 IEEE International Conference on Wireless Information Technology and Systems, ICWITS 2012). https://doi.org/10.1109/ICWITS.2012.6417762