Design, fabrication and characterization of an integrated micro heat pipe

Man Lee, Man Wong, Yitshak Zohar

Research output: Contribution to conferencePaper

5 Scopus citations

Abstract

The design, fabrication and characterization of an integrated microsystem consisting of micro heat pipes, a micro heater, temperature and capacitive microsensors are presented. CMOS-compatible micromachining techniques are utilized to fabricate the micro heat pipe device capped by a nitride layer. In order to allow clear visualizations of the flow patterns during operation, the process has been modified using a glass wafer to cap the heat pipes. Temperature distributions along the micro heat pipes have been measured using the microsensors located next to the heat pipes. The capacitive microsensors have been used to measure the void-fraction, taking advantage of the large difference between the dielectric constants of the liquid and vapor phases.

Original languageEnglish (US)
Pages85-88
Number of pages4
StatePublished - Jan 1 2002
Externally publishedYes
Event15th IEEE International Conference on Micro Electro Mechanical Systems MEMS 2002 - Las Vegas, NV, United States
Duration: Jan 20 2002Jan 24 2002

Other

Other15th IEEE International Conference on Micro Electro Mechanical Systems MEMS 2002
CountryUnited States
CityLas Vegas, NV
Period1/20/021/24/02

ASJC Scopus subject areas

  • Control and Systems Engineering
  • Mechanical Engineering
  • Electrical and Electronic Engineering

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  • Cite this

    Lee, M., Wong, M., & Zohar, Y. (2002). Design, fabrication and characterization of an integrated micro heat pipe. 85-88. Paper presented at 15th IEEE International Conference on Micro Electro Mechanical Systems MEMS 2002, Las Vegas, NV, United States.