Determining the effects of slurry surfactant, abrasive size, and abrasive content on the tribology and kinetics of copper CMP

Z. Li, K. Ina, P. Lefevre, I. Koshiyama, A. Philipossian

Research output: Contribution to journalArticlepeer-review

46 Scopus citations

Fingerprint Dive into the research topics of 'Determining the effects of slurry surfactant, abrasive size, and abrasive content on the tribology and kinetics of copper CMP'. Together they form a unique fingerprint.

Chemical Compounds

Physics & Astronomy

Engineering & Materials Science