Development and analysis of a high-pressure micro jet pad conditioning system for interlayer dielectric chemical mechanical planarization

Yoshiyuki Seike, Darren Denardis, Masano Sugiyama, Keiji Miyachi, Toshiro Doi, Ara Philipossian

Research output: Contribution to journalArticle

7 Citations (Scopus)

Abstract

Conventional diamond disc pad conditioning methods employed in chemical mechanical planarization (CMP) have presented several problems for integrated circuit (IC) manufacturers. These include diamond wear, which reduces pad life, and diamond fracture, which causes the semiconductor devices to be scratched by loose diamond fragments. In order to attempt to overcome these problems, a high-pressure micro jet (HPMJ) conditioning system, in which pressurized ultra pure water (UPW) ranging from 3-30 MPa is sprayed on the pad surface, is proposed and developed. This study first analyzes the extent of the kinetic energy of water droplets ejecting from the HPMJ system and its utility in conditioning the pad surface. Subsequently, CMP is used to polish interlayer dielectric (ILD) films using both conventional diamond discs as well as HPMJ conditioning methods. Results, reported in the form of coefficient of friction (COF), removal rate, pad surface roughness and pad surface quality, highlight both the advantages as well as disadvantages of the HPMJ method compared to conventional conditioning schemes.

Original languageEnglish (US)
Pages (from-to)1225-1231
Number of pages7
JournalJapanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers
Volume44
Issue number3
DOIs
StatePublished - Mar 2005

Fingerprint

Chemical mechanical polishing
conditioning
interlayers
Diamonds
diamonds
Dielectric films
Semiconductor devices
Kinetic energy
Surface properties
Integrated circuits
Water
semiconductor devices
coefficient of friction
water
Surface roughness
integrated circuits
Wear of materials
Friction
surface roughness
kinetic energy

Keywords

  • Chemical mechanical planarization (CMP)
  • Coefficient of friction (COF)
  • Flow rate
  • High-pressure micro jet (HPMJ)
  • Inter layer dielectric (ILD)
  • Kinetic energy
  • Pad conditioning
  • Removal rate

ASJC Scopus subject areas

  • Physics and Astronomy (miscellaneous)

Cite this

Development and analysis of a high-pressure micro jet pad conditioning system for interlayer dielectric chemical mechanical planarization. / Seike, Yoshiyuki; Denardis, Darren; Sugiyama, Masano; Miyachi, Keiji; Doi, Toshiro; Philipossian, Ara.

In: Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers, Vol. 44, No. 3, 03.2005, p. 1225-1231.

Research output: Contribution to journalArticle

@article{d059c27e8e3d478bb646975723bf134a,
title = "Development and analysis of a high-pressure micro jet pad conditioning system for interlayer dielectric chemical mechanical planarization",
abstract = "Conventional diamond disc pad conditioning methods employed in chemical mechanical planarization (CMP) have presented several problems for integrated circuit (IC) manufacturers. These include diamond wear, which reduces pad life, and diamond fracture, which causes the semiconductor devices to be scratched by loose diamond fragments. In order to attempt to overcome these problems, a high-pressure micro jet (HPMJ) conditioning system, in which pressurized ultra pure water (UPW) ranging from 3-30 MPa is sprayed on the pad surface, is proposed and developed. This study first analyzes the extent of the kinetic energy of water droplets ejecting from the HPMJ system and its utility in conditioning the pad surface. Subsequently, CMP is used to polish interlayer dielectric (ILD) films using both conventional diamond discs as well as HPMJ conditioning methods. Results, reported in the form of coefficient of friction (COF), removal rate, pad surface roughness and pad surface quality, highlight both the advantages as well as disadvantages of the HPMJ method compared to conventional conditioning schemes.",
keywords = "Chemical mechanical planarization (CMP), Coefficient of friction (COF), Flow rate, High-pressure micro jet (HPMJ), Inter layer dielectric (ILD), Kinetic energy, Pad conditioning, Removal rate",
author = "Yoshiyuki Seike and Darren Denardis and Masano Sugiyama and Keiji Miyachi and Toshiro Doi and Ara Philipossian",
year = "2005",
month = "3",
doi = "10.1143/JJAP.44.1225",
language = "English (US)",
volume = "44",
pages = "1225--1231",
journal = "Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes",
issn = "0021-4922",
publisher = "Japan Society of Applied Physics",
number = "3",

}

TY - JOUR

T1 - Development and analysis of a high-pressure micro jet pad conditioning system for interlayer dielectric chemical mechanical planarization

AU - Seike, Yoshiyuki

AU - Denardis, Darren

AU - Sugiyama, Masano

AU - Miyachi, Keiji

AU - Doi, Toshiro

AU - Philipossian, Ara

PY - 2005/3

Y1 - 2005/3

N2 - Conventional diamond disc pad conditioning methods employed in chemical mechanical planarization (CMP) have presented several problems for integrated circuit (IC) manufacturers. These include diamond wear, which reduces pad life, and diamond fracture, which causes the semiconductor devices to be scratched by loose diamond fragments. In order to attempt to overcome these problems, a high-pressure micro jet (HPMJ) conditioning system, in which pressurized ultra pure water (UPW) ranging from 3-30 MPa is sprayed on the pad surface, is proposed and developed. This study first analyzes the extent of the kinetic energy of water droplets ejecting from the HPMJ system and its utility in conditioning the pad surface. Subsequently, CMP is used to polish interlayer dielectric (ILD) films using both conventional diamond discs as well as HPMJ conditioning methods. Results, reported in the form of coefficient of friction (COF), removal rate, pad surface roughness and pad surface quality, highlight both the advantages as well as disadvantages of the HPMJ method compared to conventional conditioning schemes.

AB - Conventional diamond disc pad conditioning methods employed in chemical mechanical planarization (CMP) have presented several problems for integrated circuit (IC) manufacturers. These include diamond wear, which reduces pad life, and diamond fracture, which causes the semiconductor devices to be scratched by loose diamond fragments. In order to attempt to overcome these problems, a high-pressure micro jet (HPMJ) conditioning system, in which pressurized ultra pure water (UPW) ranging from 3-30 MPa is sprayed on the pad surface, is proposed and developed. This study first analyzes the extent of the kinetic energy of water droplets ejecting from the HPMJ system and its utility in conditioning the pad surface. Subsequently, CMP is used to polish interlayer dielectric (ILD) films using both conventional diamond discs as well as HPMJ conditioning methods. Results, reported in the form of coefficient of friction (COF), removal rate, pad surface roughness and pad surface quality, highlight both the advantages as well as disadvantages of the HPMJ method compared to conventional conditioning schemes.

KW - Chemical mechanical planarization (CMP)

KW - Coefficient of friction (COF)

KW - Flow rate

KW - High-pressure micro jet (HPMJ)

KW - Inter layer dielectric (ILD)

KW - Kinetic energy

KW - Pad conditioning

KW - Removal rate

UR - http://www.scopus.com/inward/record.url?scp=19944383189&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=19944383189&partnerID=8YFLogxK

U2 - 10.1143/JJAP.44.1225

DO - 10.1143/JJAP.44.1225

M3 - Article

AN - SCOPUS:19944383189

VL - 44

SP - 1225

EP - 1231

JO - Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes

JF - Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes

SN - 0021-4922

IS - 3

ER -