Development of 60-GHz wireless interconnects for interchip data transmission

Ho Hsin Yeh, Kathleen L Melde

Research output: Contribution to journalArticle

11 Scopus citations

Abstract

This paper presents radio frequency data transmissions via 60-GHz antennas or wireless interconnects in multichip multicore computing architectures. An antenna in package is used as the design configuration to be placed on top of the silicon circuitry. The packaging design includes an artificial magnetic conductor to enhance the operating bandwidth, a two-element antenna array to increase the transmission gain, and an integrated power divider. This paper compares the wireless link budget of antenna-based interconnects in terms of the Friis transmission equation. This defines the power needed to be recovered by wireless transceivers (PRE). The design demonstrates an 11 GHz measured operating bandwidth and shows that with a two-element array; the P RE is reduced by 10 dB over that with a link that uses a single antenna.

Original languageEnglish (US)
Article number6570734
Pages (from-to)1946-1952
Number of pages7
JournalIEEE Transactions on Components, Packaging and Manufacturing Technology
Volume3
Issue number11
DOIs
Publication statusPublished - 2013

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Keywords

  • 60 GHz antennas
  • Electronic packaging design
  • Radio frequency (RF) interconnects
  • Wireless link budget

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Industrial and Manufacturing Engineering

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