Development of a broadband coplanar waveguide-to-microstrip transition with vias

Zhen Zhou, Kathleen L Melde

Research output: Contribution to journalArticle

20 Citations (Scopus)

Abstract

A transition from coplanar waveguide (CPW)-to- microstrip with vias is often used in wafer-probe measurements. This paper shows how field and impedance matching are used to develop a wideband transition. This paper demonstrates how the presence and placement of the vias affect the bandwidth and alters the impedance of the transition. The measured results on a transition show that a wideband transition with return loss better than 10 dB and an insertion loss less than 1.5 dB up to 36.64 GHz is obtained. The measurements show excellent agreement with simulation. The work presented in this paper provides a better understanding about a CPW-to-microstrip transition with vias as well as design procedures and principles that can be utilized to facilitate the realization of a broadband CPW-to-microstrip transition with vias.

Original languageEnglish (US)
Pages (from-to)861-872
Number of pages12
JournalIEEE Transactions on Advanced Packaging
Volume31
Issue number4
DOIs
StatePublished - 2008

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Coplanar waveguides
Insertion losses
Bandwidth

Keywords

  • Coplanar waveguide (CPW)-to-microstrip transition
  • On-wafer measurements
  • Parallel plate waveguide mode suppression

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Development of a broadband coplanar waveguide-to-microstrip transition with vias. / Zhou, Zhen; Melde, Kathleen L.

In: IEEE Transactions on Advanced Packaging, Vol. 31, No. 4, 2008, p. 861-872.

Research output: Contribution to journalArticle

@article{06e77b5a6ad2453a8bfc1d51ccf6baf6,
title = "Development of a broadband coplanar waveguide-to-microstrip transition with vias",
abstract = "A transition from coplanar waveguide (CPW)-to- microstrip with vias is often used in wafer-probe measurements. This paper shows how field and impedance matching are used to develop a wideband transition. This paper demonstrates how the presence and placement of the vias affect the bandwidth and alters the impedance of the transition. The measured results on a transition show that a wideband transition with return loss better than 10 dB and an insertion loss less than 1.5 dB up to 36.64 GHz is obtained. The measurements show excellent agreement with simulation. The work presented in this paper provides a better understanding about a CPW-to-microstrip transition with vias as well as design procedures and principles that can be utilized to facilitate the realization of a broadband CPW-to-microstrip transition with vias.",
keywords = "Coplanar waveguide (CPW)-to-microstrip transition, On-wafer measurements, Parallel plate waveguide mode suppression",
author = "Zhen Zhou and Melde, {Kathleen L}",
year = "2008",
doi = "10.1109/TADVP.2008.924254",
language = "English (US)",
volume = "31",
pages = "861--872",
journal = "IEEE Transactions on Advanced Packaging",
issn = "1521-3323",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
number = "4",

}

TY - JOUR

T1 - Development of a broadband coplanar waveguide-to-microstrip transition with vias

AU - Zhou, Zhen

AU - Melde, Kathleen L

PY - 2008

Y1 - 2008

N2 - A transition from coplanar waveguide (CPW)-to- microstrip with vias is often used in wafer-probe measurements. This paper shows how field and impedance matching are used to develop a wideband transition. This paper demonstrates how the presence and placement of the vias affect the bandwidth and alters the impedance of the transition. The measured results on a transition show that a wideband transition with return loss better than 10 dB and an insertion loss less than 1.5 dB up to 36.64 GHz is obtained. The measurements show excellent agreement with simulation. The work presented in this paper provides a better understanding about a CPW-to-microstrip transition with vias as well as design procedures and principles that can be utilized to facilitate the realization of a broadband CPW-to-microstrip transition with vias.

AB - A transition from coplanar waveguide (CPW)-to- microstrip with vias is often used in wafer-probe measurements. This paper shows how field and impedance matching are used to develop a wideband transition. This paper demonstrates how the presence and placement of the vias affect the bandwidth and alters the impedance of the transition. The measured results on a transition show that a wideband transition with return loss better than 10 dB and an insertion loss less than 1.5 dB up to 36.64 GHz is obtained. The measurements show excellent agreement with simulation. The work presented in this paper provides a better understanding about a CPW-to-microstrip transition with vias as well as design procedures and principles that can be utilized to facilitate the realization of a broadband CPW-to-microstrip transition with vias.

KW - Coplanar waveguide (CPW)-to-microstrip transition

KW - On-wafer measurements

KW - Parallel plate waveguide mode suppression

UR - http://www.scopus.com/inward/record.url?scp=57749122044&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=57749122044&partnerID=8YFLogxK

U2 - 10.1109/TADVP.2008.924254

DO - 10.1109/TADVP.2008.924254

M3 - Article

VL - 31

SP - 861

EP - 872

JO - IEEE Transactions on Advanced Packaging

JF - IEEE Transactions on Advanced Packaging

SN - 1521-3323

IS - 4

ER -