Dispersion Number Studies in Chemical Mechanical Planarization

Ara Philipossian, Erin Mitchell

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This study explores aspects of the fluid dynamics of CMP processes. The residence time distribution of slurry under the wafer is experimentally determined and used to calculate the Dispersion Number (Δ) of the fluid in the wafer-pad region based on a dispersion model for non-ideal reactors. Furthermore, lubrication theory is used to explain flow behaviors at various operating conditions. Results indicate that at low wafer pressure and high relative pad-wafer velocity, the slurry exhibits nearly ideal plug flow behavior. As pressure increases and velocity decreases, flow begins to deviate from ideality and the slurry becomes increasingly more mixed beneath the wafer. These phenomena are confirmed to be the result of variable slurry film thicknesses between the pad and the wafer, as measured by changes in the coefficient of friction (COF) in the pad-wafer interface.

Original languageEnglish (US)
Title of host publicationMaterials Research Society Symposium - Proceedings
EditorsD.S. Boning, K. Devriendt, M.R. Oliver, D.J. Stein, I. Vos
Pages193-197
Number of pages5
Volume767
StatePublished - 2003
EventChemical-Mechanical Planarization - San Francisco, CA, United States
Duration: Apr 22 2003Apr 24 2003

Other

OtherChemical-Mechanical Planarization
CountryUnited States
CitySan Francisco, CA
Period4/22/034/24/03

Fingerprint

Chemical mechanical polishing
Cytidine Monophosphate
Residence time distribution
Fluid dynamics
Flow velocity
Lubrication
Film thickness
Friction
Fluids

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials

Cite this

Philipossian, A., & Mitchell, E. (2003). Dispersion Number Studies in Chemical Mechanical Planarization. In D. S. Boning, K. Devriendt, M. R. Oliver, D. J. Stein, & I. Vos (Eds.), Materials Research Society Symposium - Proceedings (Vol. 767, pp. 193-197)

Dispersion Number Studies in Chemical Mechanical Planarization. / Philipossian, Ara; Mitchell, Erin.

Materials Research Society Symposium - Proceedings. ed. / D.S. Boning; K. Devriendt; M.R. Oliver; D.J. Stein; I. Vos. Vol. 767 2003. p. 193-197.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Philipossian, A & Mitchell, E 2003, Dispersion Number Studies in Chemical Mechanical Planarization. in DS Boning, K Devriendt, MR Oliver, DJ Stein & I Vos (eds), Materials Research Society Symposium - Proceedings. vol. 767, pp. 193-197, Chemical-Mechanical Planarization, San Francisco, CA, United States, 4/22/03.
Philipossian A, Mitchell E. Dispersion Number Studies in Chemical Mechanical Planarization. In Boning DS, Devriendt K, Oliver MR, Stein DJ, Vos I, editors, Materials Research Society Symposium - Proceedings. Vol. 767. 2003. p. 193-197
Philipossian, Ara ; Mitchell, Erin. / Dispersion Number Studies in Chemical Mechanical Planarization. Materials Research Society Symposium - Proceedings. editor / D.S. Boning ; K. Devriendt ; M.R. Oliver ; D.J. Stein ; I. Vos. Vol. 767 2003. pp. 193-197
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