Distributed optical data bus for board-level interconnects

Raymond K. Kostuk, Jang Hun Yeh, Mark Fink

Research output: Contribution to journalArticle

17 Scopus citations

Abstract

A design for a distributed free-space optical system is presented that provides interconnection of electronic processing elements at the board level of packaging. The system can be expanded to more than two boards and transfers an array of data in parallel between connection planes. The design uses binary optic microlens arrays to collimate and collect light from surface-emitting lasers, and it uses substratemode holographic window elements for directing light to and from the bus region. The use of a collection lens array for extending the alignment tolerance of the imaging system is also discussed. The paper concludes with experimental demonstrations of critical system components and performance with 64-bit data arrays.

Original languageEnglish (US)
Pages (from-to)5010-5021
Number of pages12
JournalApplied optics
Volume32
Issue number26
DOIs
StatePublished - Sep 10 1993

Keywords

  • Board-level interconnects
  • Optical interconnects
  • Substrate-mode holographic elements

ASJC Scopus subject areas

  • Atomic and Molecular Physics, and Optics
  • Engineering (miscellaneous)
  • Electrical and Electronic Engineering

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