Effective chemical cleaning of silicon surfaces prior to gate oxidation is critical in ensuring reliable gate oxide integrity. Of equal importance is the ability to keep the silicon surface free of any contamination during subsequent thermal processing. During the thermal oxidation of silicon, Ambient Air Infiltration (AAI) has been shown to be a significant source of wafer-to-wafer and within wafer thickness variability. AAI has also been shown to be a major factor in affecting the total oxide charge. Increasing reactant gas flow rates, processing the wafers in encapsulated cantilevers, optimum placement of gas baffles, and controlling reactor exhaust rates have helped reduce ambient air infiltration and the detrimental effects of this source of contamination.
|Original language||English (US)|
|Number of pages||11|
|Journal||Proceedings - The Electrochemical Society|
|State||Published - Dec 1 1990|
|Event||Procedings of the First International Symposium on Cleaning Technology in Semiconductor Device Manufacturing (held at the 176th Meeting of the Electrochemical Society) - Hollywood, FL, USA|
Duration: Oct 15 1989 → Oct 20 1989
ASJC Scopus subject areas