Effect of conditioning and slurry application method on silicon dioxide removal rates using a ceria-based chemical mechanical planarization slurry

Ruochen Han, Yasa Sampurno, Matthew Bahr, Leonard Borucki, Ara Philipossian

Research output: Contribution to journalArticlepeer-review

5 Scopus citations

Fingerprint Dive into the research topics of 'Effect of conditioning and slurry application method on silicon dioxide removal rates using a ceria-based chemical mechanical planarization slurry'. Together they form a unique fingerprint.

Chemical Compounds

Engineering & Materials Science