Effect of dissolved CO 2 in de-ionized water in reducing wafer damage during megasonic cleaning in MegPie®

S. Kumari, M. Keswani, S. Singh, M. Beck, E. Liebscher, L. Q. Toan, S. Raghavan

Research output: Chapter in Book/Report/Conference proceedingConference contribution

20 Scopus citations

Abstract

Particle removal from wafer surfaces can be accomplished by irradiation of cleaning fluid by sound waves in the MHz frequency range. Unfortunately, unless proper cleaning conditions are chosen, megasonic irradiation may also result in damage to fragile wafer features. Here, we demonstrate a strong effect of dissolved CO 2 levels on the reduction of wafer damage during megasonic cleaning. Test structures with L/S patterns were irradiated with 0.93 MHz sound waves at varying power densities and dissolved CO 2 levels, in a single wafer spin cleaning tool, MegPie®. Dissolution of increasing amounts of CO 2 in air saturated DI water caused a significant decrease in the number of breakages to line structures and also decreased the lengths of the line breakages, at all power densities up to 2.94 W/cm 2. This ability of dissolved CO 2 to protect against feature damage correlates well with its ability to suppress sonoluminescence in sound irradiated DI water.

Original languageEnglish (US)
Title of host publicationSemiconductor Cleaning Science and Technology 12, SCST 12
Pages93-99
Number of pages7
Edition5
DOIs
StatePublished - Dec 1 2011
Event12th International Symposium on Semiconductor Cleaning Science and Technology, SCST12 - 220th ECS Meeting - Boston, MA, United States
Duration: Oct 10 2011Oct 11 2011

Publication series

NameECS Transactions
Number5
Volume41
ISSN (Print)1938-5862
ISSN (Electronic)1938-6737

Other

Other12th International Symposium on Semiconductor Cleaning Science and Technology, SCST12 - 220th ECS Meeting
CountryUnited States
CityBoston, MA
Period10/10/1110/11/11

ASJC Scopus subject areas

  • Engineering(all)

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    Kumari, S., Keswani, M., Singh, S., Beck, M., Liebscher, E., Toan, L. Q., & Raghavan, S. (2011). Effect of dissolved CO 2 in de-ionized water in reducing wafer damage during megasonic cleaning in MegPie®. In Semiconductor Cleaning Science and Technology 12, SCST 12 (5 ed., pp. 93-99). (ECS Transactions; Vol. 41, No. 5). https://doi.org/10.1149/1.3630831