Effect of novel pad groove designs on the frictional and removal rate characteristics of ILD CMP

D. Rosales-Yeomans, T. Doi, M. Kinoshita, Ara Philipossian

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The impact of parameters such as groove design, wafer pressure and relative pad-wafer velocity on average coefficient of friction (COF) and ILD removal rates of chemical and mechanical polishing (CMP) was investigated. The Sommerfield number, used in conjunction with COF, presented a useful method of describing the extent of contact in the pad-slurry-wafer interface. It was found that the amount of material removed was directly influenced by average COF. Combined grooving patterns, consisting of spiral and logarithmic grooves, influenced several key attributes of ILD polish in terms of slurry retention, tribological mechanism and material removal rates.

Original languageEnglish (US)
Title of host publicationProceedings - Electrochemical Society
EditorsS. Seal, R.L. Opila, K.B. Sundaram, R. Singh
Pages166-173
Number of pages8
Volume21
StatePublished - 2003
EventChemical Mechanical Planarization VI - Proceddings of the International Symposium - Orlando, FL., United States
Duration: Oct 12 2003Oct 17 2003

Other

OtherChemical Mechanical Planarization VI - Proceddings of the International Symposium
CountryUnited States
CityOrlando, FL.
Period10/12/0310/17/03

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Polishing
Friction

ASJC Scopus subject areas

  • Engineering(all)

Cite this

Rosales-Yeomans, D., Doi, T., Kinoshita, M., & Philipossian, A. (2003). Effect of novel pad groove designs on the frictional and removal rate characteristics of ILD CMP. In S. Seal, R. L. Opila, K. B. Sundaram, & R. Singh (Eds.), Proceedings - Electrochemical Society (Vol. 21, pp. 166-173)

Effect of novel pad groove designs on the frictional and removal rate characteristics of ILD CMP. / Rosales-Yeomans, D.; Doi, T.; Kinoshita, M.; Philipossian, Ara.

Proceedings - Electrochemical Society. ed. / S. Seal; R.L. Opila; K.B. Sundaram; R. Singh. Vol. 21 2003. p. 166-173.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Rosales-Yeomans, D, Doi, T, Kinoshita, M & Philipossian, A 2003, Effect of novel pad groove designs on the frictional and removal rate characteristics of ILD CMP. in S Seal, RL Opila, KB Sundaram & R Singh (eds), Proceedings - Electrochemical Society. vol. 21, pp. 166-173, Chemical Mechanical Planarization VI - Proceddings of the International Symposium, Orlando, FL., United States, 10/12/03.
Rosales-Yeomans D, Doi T, Kinoshita M, Philipossian A. Effect of novel pad groove designs on the frictional and removal rate characteristics of ILD CMP. In Seal S, Opila RL, Sundaram KB, Singh R, editors, Proceedings - Electrochemical Society. Vol. 21. 2003. p. 166-173
Rosales-Yeomans, D. ; Doi, T. ; Kinoshita, M. ; Philipossian, Ara. / Effect of novel pad groove designs on the frictional and removal rate characteristics of ILD CMP. Proceedings - Electrochemical Society. editor / S. Seal ; R.L. Opila ; K.B. Sundaram ; R. Singh. Vol. 21 2003. pp. 166-173
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