Effect of pad groove design on slurry injection scheme during interlayer dielectric chemical mechanical planarization

C. Wu, Y. Sampurno, X. Liao, Y. Zhuang, L. Borucki, S. Theng, Ara Philipossian

Research output: Contribution to journalArticle

6 Citations (Scopus)

Abstract

In this study, the effect of pad groove design on slurry injection scheme during interlayer dielectric chemical mechanical planarization was investigated. A novel slurry injection system (SIS) with multiple slurry outlets was designed to allow fresh slurry to be injected through one or multiple points. At first, the SIS with one injection point scheme was compared with the standard slurry application method on a concentrically grooved pad and an xy-groove pad. On the concentrically grooved pad, the SIS with one injection point scheme generated significantly higher oxide removal rates (ranging from 22 to 35 percent) compared to the standard slurry application method at different slurry flow rates. On the xy-groove pad, the SIS with one injection point scheme still resulted in higher removal rates (ranging from 3 to 9 percent), however, its removal rate enhancement was not as high as that of the concentrically grooved pad. In order to further improve slurry availability on the xy-groove pad, SIS with multi-injection point scheme was tested. Results showed that the SIS with multi-injection point scheme resulted in significantly higher removal rates (ranging from 17 to 20 percent) compared to the standard slurry application method. This work underscored the importance of optimum slurry injection scheme for accommodating particular pad groove designs.

Original languageEnglish (US)
Pages (from-to)P272-P276
JournalECS Journal of Solid State Science and Technology
Volume4
Issue number7
DOIs
StatePublished - 2015

Fingerprint

Chemical mechanical polishing
Oxides
Flow rate
Availability

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials

Cite this

Effect of pad groove design on slurry injection scheme during interlayer dielectric chemical mechanical planarization. / Wu, C.; Sampurno, Y.; Liao, X.; Zhuang, Y.; Borucki, L.; Theng, S.; Philipossian, Ara.

In: ECS Journal of Solid State Science and Technology, Vol. 4, No. 7, 2015, p. P272-P276.

Research output: Contribution to journalArticle

@article{0186c966ff8a41fea7af51b63924561a,
title = "Effect of pad groove design on slurry injection scheme during interlayer dielectric chemical mechanical planarization",
abstract = "In this study, the effect of pad groove design on slurry injection scheme during interlayer dielectric chemical mechanical planarization was investigated. A novel slurry injection system (SIS) with multiple slurry outlets was designed to allow fresh slurry to be injected through one or multiple points. At first, the SIS with one injection point scheme was compared with the standard slurry application method on a concentrically grooved pad and an xy-groove pad. On the concentrically grooved pad, the SIS with one injection point scheme generated significantly higher oxide removal rates (ranging from 22 to 35 percent) compared to the standard slurry application method at different slurry flow rates. On the xy-groove pad, the SIS with one injection point scheme still resulted in higher removal rates (ranging from 3 to 9 percent), however, its removal rate enhancement was not as high as that of the concentrically grooved pad. In order to further improve slurry availability on the xy-groove pad, SIS with multi-injection point scheme was tested. Results showed that the SIS with multi-injection point scheme resulted in significantly higher removal rates (ranging from 17 to 20 percent) compared to the standard slurry application method. This work underscored the importance of optimum slurry injection scheme for accommodating particular pad groove designs.",
author = "C. Wu and Y. Sampurno and X. Liao and Y. Zhuang and L. Borucki and S. Theng and Ara Philipossian",
year = "2015",
doi = "10.1149/2.0281507jss",
language = "English (US)",
volume = "4",
pages = "P272--P276",
journal = "ECS Journal of Solid State Science and Technology",
issn = "2162-8769",
publisher = "Electrochemical Society, Inc.",
number = "7",

}

TY - JOUR

T1 - Effect of pad groove design on slurry injection scheme during interlayer dielectric chemical mechanical planarization

AU - Wu, C.

AU - Sampurno, Y.

AU - Liao, X.

AU - Zhuang, Y.

AU - Borucki, L.

AU - Theng, S.

AU - Philipossian, Ara

PY - 2015

Y1 - 2015

N2 - In this study, the effect of pad groove design on slurry injection scheme during interlayer dielectric chemical mechanical planarization was investigated. A novel slurry injection system (SIS) with multiple slurry outlets was designed to allow fresh slurry to be injected through one or multiple points. At first, the SIS with one injection point scheme was compared with the standard slurry application method on a concentrically grooved pad and an xy-groove pad. On the concentrically grooved pad, the SIS with one injection point scheme generated significantly higher oxide removal rates (ranging from 22 to 35 percent) compared to the standard slurry application method at different slurry flow rates. On the xy-groove pad, the SIS with one injection point scheme still resulted in higher removal rates (ranging from 3 to 9 percent), however, its removal rate enhancement was not as high as that of the concentrically grooved pad. In order to further improve slurry availability on the xy-groove pad, SIS with multi-injection point scheme was tested. Results showed that the SIS with multi-injection point scheme resulted in significantly higher removal rates (ranging from 17 to 20 percent) compared to the standard slurry application method. This work underscored the importance of optimum slurry injection scheme for accommodating particular pad groove designs.

AB - In this study, the effect of pad groove design on slurry injection scheme during interlayer dielectric chemical mechanical planarization was investigated. A novel slurry injection system (SIS) with multiple slurry outlets was designed to allow fresh slurry to be injected through one or multiple points. At first, the SIS with one injection point scheme was compared with the standard slurry application method on a concentrically grooved pad and an xy-groove pad. On the concentrically grooved pad, the SIS with one injection point scheme generated significantly higher oxide removal rates (ranging from 22 to 35 percent) compared to the standard slurry application method at different slurry flow rates. On the xy-groove pad, the SIS with one injection point scheme still resulted in higher removal rates (ranging from 3 to 9 percent), however, its removal rate enhancement was not as high as that of the concentrically grooved pad. In order to further improve slurry availability on the xy-groove pad, SIS with multi-injection point scheme was tested. Results showed that the SIS with multi-injection point scheme resulted in significantly higher removal rates (ranging from 17 to 20 percent) compared to the standard slurry application method. This work underscored the importance of optimum slurry injection scheme for accommodating particular pad groove designs.

UR - http://www.scopus.com/inward/record.url?scp=84930170886&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84930170886&partnerID=8YFLogxK

U2 - 10.1149/2.0281507jss

DO - 10.1149/2.0281507jss

M3 - Article

VL - 4

SP - P272-P276

JO - ECS Journal of Solid State Science and Technology

JF - ECS Journal of Solid State Science and Technology

SN - 2162-8769

IS - 7

ER -