Effect of pad groove designs on the frictional and removal rate characteristics of ILD CMP

D. Rosales-Yeomans, T. Doi, M. Kinoshita, T. Suzuki, Ara Philipossian

Research output: Contribution to journalArticle

27 Citations (Scopus)

Abstract

Real-time coefficient of friction (COF) analysis was used to determine the extent of normal and shear forces during chemical mechanical planarization (CMP) and identify the lubrication mechanism of the process. Experiments were done on a scaled polisher using IC-1000 pads with various surface textures, and Fujimi's PL-4217 fumed silica slurry over a wide range of applied pressures and relative pad-wafer velocities. Stribeck curves showed that pad texture dictated the overall lubrication mechanism of the system. Average COF results yielded valuable information regarding the overall range of frictional forces associated with each type of surface texture. The linear correlation between COF data and interlayer dielectric (ILD) removal rate was consistent with previously published correlation graphs involving a variety of conventional pad textures and fumed silica concentrations. Spectral analysis of real-time friction data was used to elucidate the lubrication mechanism of the process in terms of the stick-slip phenomena and to quantify the total amount of hydrodynamic chattering as a function of various pad surface textures. For a given lubrication mechanism, analysis of the spectra for various textures indicated significant differences that were attributed to the amount of slurry present in the pad-wafer interface.

Original languageEnglish (US)
JournalJournal of the Electrochemical Society
Volume152
Issue number1
DOIs
StatePublished - 2005

Fingerprint

Chemical mechanical polishing
grooves
interlayers
textures
Textures
lubrication
Lubrication
coefficient of friction
Friction
Bearing pads
Silicon Dioxide
Silica
wafers
silicon dioxide
Stick-slip
Spectrum analysis
spectrum analysis
slip
friction
Hydrodynamics

ASJC Scopus subject areas

  • Electrochemistry
  • Surfaces, Coatings and Films
  • Surfaces and Interfaces

Cite this

Effect of pad groove designs on the frictional and removal rate characteristics of ILD CMP. / Rosales-Yeomans, D.; Doi, T.; Kinoshita, M.; Suzuki, T.; Philipossian, Ara.

In: Journal of the Electrochemical Society, Vol. 152, No. 1, 2005.

Research output: Contribution to journalArticle

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