Effect of pad micro-texture on frictional force, removal rate, and wafer topography during copper CMP process

Y. Zhuang, X. Liao, L. J. Borucki, S. Theng, X. Wei, T. Ashizawa, A. Philipossian

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Scopus citations

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Engineering & Materials Science