Effect of pad surface micro-texture on coefficient of friction and removal rate during copper CMP process

X. Liao, Y. Zhuang, L. J. Borucki, S. Theng, X. Wei, T. Ashizawa, Ara Philipossian

Research output: Contribution to journalArticle

10 Citations (Scopus)

Abstract

In this study, 200-mm blanket copper wafers were polished on an IC1010 M-groove pad, which was conditioned by a 3M A2810 disc and Mitsubishi Materials Corporation (MMC) TRD disc. Pad surface contact area and topography were analyzed using laser confocal microscopy and scanning electron microscopy. The MMC TRD disc generated a lot of large near contact areas corresponding to fractured and collapsed pore walls. The fractured and collapsed pore walls partly covered the adjacent pores, making the pad surface more lubricated during wafer polishing and rendering significantly lower coefficient of friction and removal rate than the 3M A2810 disc.

Original languageEnglish (US)
JournalElectrochemical and Solid-State Letters
Volume14
Issue number5
DOIs
StatePublished - 2011

Fingerprint

Cytidine Monophosphate
coefficient of friction
Copper
textures
Textures
Friction
copper
Confocal microscopy
Polishing
porosity
Topography
Industry
wafers
laser microscopy
Scanning electron microscopy
Lasers
blankets
polishing
grooves
topography

ASJC Scopus subject areas

  • Electrochemistry
  • Electrical and Electronic Engineering
  • Materials Science(all)
  • Chemical Engineering(all)
  • Physical and Theoretical Chemistry

Cite this

Effect of pad surface micro-texture on coefficient of friction and removal rate during copper CMP process. / Liao, X.; Zhuang, Y.; Borucki, L. J.; Theng, S.; Wei, X.; Ashizawa, T.; Philipossian, Ara.

In: Electrochemical and Solid-State Letters, Vol. 14, No. 5, 2011.

Research output: Contribution to journalArticle

@article{75be2f50af3f45a1bc3a54961f4a5868,
title = "Effect of pad surface micro-texture on coefficient of friction and removal rate during copper CMP process",
abstract = "In this study, 200-mm blanket copper wafers were polished on an IC1010 M-groove pad, which was conditioned by a 3M A2810 disc and Mitsubishi Materials Corporation (MMC) TRD disc. Pad surface contact area and topography were analyzed using laser confocal microscopy and scanning electron microscopy. The MMC TRD disc generated a lot of large near contact areas corresponding to fractured and collapsed pore walls. The fractured and collapsed pore walls partly covered the adjacent pores, making the pad surface more lubricated during wafer polishing and rendering significantly lower coefficient of friction and removal rate than the 3M A2810 disc.",
author = "X. Liao and Y. Zhuang and Borucki, {L. J.} and S. Theng and X. Wei and T. Ashizawa and Ara Philipossian",
year = "2011",
doi = "10.1149/1.3555072",
language = "English (US)",
volume = "14",
journal = "Electrochemical and Solid-State Letters",
issn = "1099-0062",
publisher = "Electrochemical Society, Inc.",
number = "5",

}

TY - JOUR

T1 - Effect of pad surface micro-texture on coefficient of friction and removal rate during copper CMP process

AU - Liao, X.

AU - Zhuang, Y.

AU - Borucki, L. J.

AU - Theng, S.

AU - Wei, X.

AU - Ashizawa, T.

AU - Philipossian, Ara

PY - 2011

Y1 - 2011

N2 - In this study, 200-mm blanket copper wafers were polished on an IC1010 M-groove pad, which was conditioned by a 3M A2810 disc and Mitsubishi Materials Corporation (MMC) TRD disc. Pad surface contact area and topography were analyzed using laser confocal microscopy and scanning electron microscopy. The MMC TRD disc generated a lot of large near contact areas corresponding to fractured and collapsed pore walls. The fractured and collapsed pore walls partly covered the adjacent pores, making the pad surface more lubricated during wafer polishing and rendering significantly lower coefficient of friction and removal rate than the 3M A2810 disc.

AB - In this study, 200-mm blanket copper wafers were polished on an IC1010 M-groove pad, which was conditioned by a 3M A2810 disc and Mitsubishi Materials Corporation (MMC) TRD disc. Pad surface contact area and topography were analyzed using laser confocal microscopy and scanning electron microscopy. The MMC TRD disc generated a lot of large near contact areas corresponding to fractured and collapsed pore walls. The fractured and collapsed pore walls partly covered the adjacent pores, making the pad surface more lubricated during wafer polishing and rendering significantly lower coefficient of friction and removal rate than the 3M A2810 disc.

UR - http://www.scopus.com/inward/record.url?scp=79952498186&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=79952498186&partnerID=8YFLogxK

U2 - 10.1149/1.3555072

DO - 10.1149/1.3555072

M3 - Article

VL - 14

JO - Electrochemical and Solid-State Letters

JF - Electrochemical and Solid-State Letters

SN - 1099-0062

IS - 5

ER -