Effect of pad surface micro-texture on removal rate during interlayer dielectric chemical mechanical planarization process

Xiaoyan Liao, Yun Zhuang, Leonard J. Borucki, Jiang Cheng, Siannie Theng, Toranosuke Ashizawa, Ara Philipossian

Research output: Contribution to journalArticle

9 Citations (Scopus)

Abstract

The effect of pad surface micro-texture on removal rate in interlayer dielectric chemical mechanical planarization was investigated. Blanket 200-mm oxide wafers were polished on a Dow® IC1000™ K-groove pad conditioned at two different conditioning forces. The coefficient of friction increased slightly (by 7%) while removal rate increased dramatically (by 65%) when conditioning force was increased from 26.7 to 44.5 N. Pad surface micro-texture analysis results showed that pad surface contact area decreased dramatically (by 71%) at the conditioning force of 44.5 N, leading to a sharp increase in the local contact pressure and resulting in a significantly higher removal rate.

Original languageEnglish (US)
Article number018001
JournalJapanese Journal of Applied Physics
Volume52
Issue number1
DOIs
StatePublished - Jan 2013

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Chemical mechanical polishing
interlayers
conditioning
textures
Textures
blankets
grooves
coefficient of friction
Friction
Oxides
wafers
oxides

ASJC Scopus subject areas

  • Engineering(all)
  • Physics and Astronomy(all)

Cite this

Effect of pad surface micro-texture on removal rate during interlayer dielectric chemical mechanical planarization process. / Liao, Xiaoyan; Zhuang, Yun; Borucki, Leonard J.; Cheng, Jiang; Theng, Siannie; Ashizawa, Toranosuke; Philipossian, Ara.

In: Japanese Journal of Applied Physics, Vol. 52, No. 1, 018001, 01.2013.

Research output: Contribution to journalArticle

Liao, Xiaoyan ; Zhuang, Yun ; Borucki, Leonard J. ; Cheng, Jiang ; Theng, Siannie ; Ashizawa, Toranosuke ; Philipossian, Ara. / Effect of pad surface micro-texture on removal rate during interlayer dielectric chemical mechanical planarization process. In: Japanese Journal of Applied Physics. 2013 ; Vol. 52, No. 1.
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