Effect of pad surface micro-texture on removal rate during tungsten chemical mechanical planarization

Yan Mu, Rouchen Han, Yasa Sampurno, Yun Zhuang, Ara Philipossian

Research output: Contribution to journalArticle

6 Citations (Scopus)

Abstract

This study investigated the effect of two conditioner discs (i.e. "Disc A" and "Disc B") during tungsten chemical mechanical planarization. Results showed that while pad temperature and removal rate increased with polishing pressure and platen velocity on both discs, "Disc B" generated consistently lower removal rates and coefficients of friction than "Disc A". To fundamentally elucidate the cause(s) of such differences, pad surface contact area and topography were analyzed using laser confocal microscopy. The comparison of the pad surface micro-texture analysis on pad surfaces conditioned by both discs indicated that "Disc A" generated a surface having a smaller abruptness (λ) and more solid contact area which resulted in a higher removal rate. In contrast, "Disc B" generated many large near-contact areas as a result of fractured and collapsed pore walls.

Original languageEnglish (US)
Pages (from-to)P345-P348
JournalECS Journal of Solid State Science and Technology
Volume5
Issue number6
DOIs
StatePublished - 2016

Fingerprint

Tungsten
Chemical mechanical polishing
Textures
Confocal microscopy
Polishing
Topography
Friction
Lasers
Temperature

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials

Cite this

Effect of pad surface micro-texture on removal rate during tungsten chemical mechanical planarization. / Mu, Yan; Han, Rouchen; Sampurno, Yasa; Zhuang, Yun; Philipossian, Ara.

In: ECS Journal of Solid State Science and Technology, Vol. 5, No. 6, 2016, p. P345-P348.

Research output: Contribution to journalArticle

@article{35e36c0e44bc48cb971e8dae426c8535,
title = "Effect of pad surface micro-texture on removal rate during tungsten chemical mechanical planarization",
abstract = "This study investigated the effect of two conditioner discs (i.e. {"}Disc A{"} and {"}Disc B{"}) during tungsten chemical mechanical planarization. Results showed that while pad temperature and removal rate increased with polishing pressure and platen velocity on both discs, {"}Disc B{"} generated consistently lower removal rates and coefficients of friction than {"}Disc A{"}. To fundamentally elucidate the cause(s) of such differences, pad surface contact area and topography were analyzed using laser confocal microscopy. The comparison of the pad surface micro-texture analysis on pad surfaces conditioned by both discs indicated that {"}Disc A{"} generated a surface having a smaller abruptness (λ) and more solid contact area which resulted in a higher removal rate. In contrast, {"}Disc B{"} generated many large near-contact areas as a result of fractured and collapsed pore walls.",
author = "Yan Mu and Rouchen Han and Yasa Sampurno and Yun Zhuang and Ara Philipossian",
year = "2016",
doi = "10.1149/2.0311606jss",
language = "English (US)",
volume = "5",
pages = "P345--P348",
journal = "ECS Journal of Solid State Science and Technology",
issn = "2162-8769",
publisher = "Electrochemical Society, Inc.",
number = "6",

}

TY - JOUR

T1 - Effect of pad surface micro-texture on removal rate during tungsten chemical mechanical planarization

AU - Mu, Yan

AU - Han, Rouchen

AU - Sampurno, Yasa

AU - Zhuang, Yun

AU - Philipossian, Ara

PY - 2016

Y1 - 2016

N2 - This study investigated the effect of two conditioner discs (i.e. "Disc A" and "Disc B") during tungsten chemical mechanical planarization. Results showed that while pad temperature and removal rate increased with polishing pressure and platen velocity on both discs, "Disc B" generated consistently lower removal rates and coefficients of friction than "Disc A". To fundamentally elucidate the cause(s) of such differences, pad surface contact area and topography were analyzed using laser confocal microscopy. The comparison of the pad surface micro-texture analysis on pad surfaces conditioned by both discs indicated that "Disc A" generated a surface having a smaller abruptness (λ) and more solid contact area which resulted in a higher removal rate. In contrast, "Disc B" generated many large near-contact areas as a result of fractured and collapsed pore walls.

AB - This study investigated the effect of two conditioner discs (i.e. "Disc A" and "Disc B") during tungsten chemical mechanical planarization. Results showed that while pad temperature and removal rate increased with polishing pressure and platen velocity on both discs, "Disc B" generated consistently lower removal rates and coefficients of friction than "Disc A". To fundamentally elucidate the cause(s) of such differences, pad surface contact area and topography were analyzed using laser confocal microscopy. The comparison of the pad surface micro-texture analysis on pad surfaces conditioned by both discs indicated that "Disc A" generated a surface having a smaller abruptness (λ) and more solid contact area which resulted in a higher removal rate. In contrast, "Disc B" generated many large near-contact areas as a result of fractured and collapsed pore walls.

UR - http://www.scopus.com/inward/record.url?scp=84976551611&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84976551611&partnerID=8YFLogxK

U2 - 10.1149/2.0311606jss

DO - 10.1149/2.0311606jss

M3 - Article

AN - SCOPUS:84976551611

VL - 5

SP - P345-P348

JO - ECS Journal of Solid State Science and Technology

JF - ECS Journal of Solid State Science and Technology

SN - 2162-8769

IS - 6

ER -