Effect of Pad Surface Texture and Slurry Abrasive Concentration on Tribological and Kinetic Attributes of ILD CMP

Ara Philipossian, Scott Olsen

Research output: Contribution to journalConference articlepeer-review

8 Scopus citations

Abstract

Real-time coefficient of friction (COF) analysis is used to determine the extent of normal and shear forces during CMP and identify the lubrication regimes associated with the process. Pads with different surface textures and slurries with varying abrasive concentrations are used to polish ILD films over a wide range of operating parameters. Results show that by varying abrasive concentration and pad surface texture, one can cause the process tribology to change from 'boundary lubrication' to 'partial lubrication', to 'hydrodynamic lubrication'. A two-phase model relating average coefficient of friction and Preston's constant is presented. At abrasive concentrations up to 9 percent, material removal is proportional to the extent of contact between the abrasives and the wafer. At abrasive concentrations between 9 to 25 percent, removal rate is directly influenced by average COF. A new parameter termed the 'tribological mechanism indicator' is defined and extracted from the data, which coupled with the information on COF and ILD removal rate, results in a series of 'universal' correlations. A qualitative model based on pad storage modulus is used to explain the trends.

Original languageEnglish (US)
Pages (from-to)119-125
Number of pages7
JournalMaterials Research Society Symposium - Proceedings
Volume767
StatePublished - Nov 10 2003
EventChemical-Mechanical Planarization - San Francisco, CA, United States
Duration: Apr 22 2003Apr 24 2003

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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