Effect of particle interaction on agglomeration of silica-based CMP slurries

Armin Sorooshian, R. Ashwani, H. K. Choi, M. Moinpour, A. Oehler, A. Tregub

Research output: Chapter in Book/Report/Conference proceedingConference contribution

16 Citations (Scopus)

Abstract

Chemical Mechanical Planarization has become a method of choice for planarization of metal and oxide layers in microelectronics industry. A CMP process includes up to 16 variables that need to be controlled to achieve a stable CMP process [1], One of the major variables in CMP is related to slurry compositions. In particularly, a uniform distribution of the sizes of the abrasive particle in slurry is crucial for a stable CMP performance. The agglomerates can be unstable, since their size depends on addition of chemical additives and shearing during the CMP process. In this work, the authors studied agglomeration of the fumed and colloidal silica-based slurries using dynamic rheometry, zeta potential tests, and an accusizer. Slurry viscosity, determined using a steady state rheometry, was correlated to the particle charge, characterized by zeta potential, and to the particle sizes obtained using the particle size analyzer. Additionally, rheometer was used for slurry shearing to study effect of shear on slurry characteristics. Particle agglomeration due to slurry shearing and storage was observed and corroborated using rheometry, zeta potential, and particle size measurements.

Original languageEnglish (US)
Title of host publicationMaterials Research Society Symposium Proceedings
EditorsD.S. Boning, J.W. Bartha, A. Philipossian, G. Shinn, I. Vos
Pages125-131
Number of pages7
Volume816
StatePublished - 2004
Externally publishedYes
EventAdvances in Chemical-Mechanical Polishing - San Francisco, CA, United States
Duration: Apr 13 2004Apr 15 2004

Other

OtherAdvances in Chemical-Mechanical Polishing
CountryUnited States
CitySan Francisco, CA
Period4/13/044/15/04

Fingerprint

Cytidine Monophosphate
Particle interactions
Slurries
Zeta potential
Shearing
Silicon Dioxide
Agglomeration
Particle size
Silica
Chemical mechanical polishing
Rheometers
Abrasives
Microelectronics
Viscosity
Oxides
Metals
Chemical analysis
Industry

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials

Cite this

Sorooshian, A., Ashwani, R., Choi, H. K., Moinpour, M., Oehler, A., & Tregub, A. (2004). Effect of particle interaction on agglomeration of silica-based CMP slurries. In D. S. Boning, J. W. Bartha, A. Philipossian, G. Shinn, & I. Vos (Eds.), Materials Research Society Symposium Proceedings (Vol. 816, pp. 125-131)

Effect of particle interaction on agglomeration of silica-based CMP slurries. / Sorooshian, Armin; Ashwani, R.; Choi, H. K.; Moinpour, M.; Oehler, A.; Tregub, A.

Materials Research Society Symposium Proceedings. ed. / D.S. Boning; J.W. Bartha; A. Philipossian; G. Shinn; I. Vos. Vol. 816 2004. p. 125-131.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Sorooshian, A, Ashwani, R, Choi, HK, Moinpour, M, Oehler, A & Tregub, A 2004, Effect of particle interaction on agglomeration of silica-based CMP slurries. in DS Boning, JW Bartha, A Philipossian, G Shinn & I Vos (eds), Materials Research Society Symposium Proceedings. vol. 816, pp. 125-131, Advances in Chemical-Mechanical Polishing, San Francisco, CA, United States, 4/13/04.
Sorooshian A, Ashwani R, Choi HK, Moinpour M, Oehler A, Tregub A. Effect of particle interaction on agglomeration of silica-based CMP slurries. In Boning DS, Bartha JW, Philipossian A, Shinn G, Vos I, editors, Materials Research Society Symposium Proceedings. Vol. 816. 2004. p. 125-131
Sorooshian, Armin ; Ashwani, R. ; Choi, H. K. ; Moinpour, M. ; Oehler, A. ; Tregub, A. / Effect of particle interaction on agglomeration of silica-based CMP slurries. Materials Research Society Symposium Proceedings. editor / D.S. Boning ; J.W. Bartha ; A. Philipossian ; G. Shinn ; I. Vos. Vol. 816 2004. pp. 125-131
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