Effect of retaining ring slot design on slurry film thickness during CMP

Xiaomin Wei, Yasa Adi Sampurno, Yun Zhuang, Roy Dittler, Anand Meled, Jiang Cheng, Christopher Wargo, Ralph Stankowski, Ara Philipossian

Research output: Contribution to journalArticle

6 Citations (Scopus)

Abstract

This article studied the effect of retaining ring slot designs on the slurry film thickness within the pad-wafer interface during chemical mechanical planarization (CMP). Two retaining rings, with "standard" and "alternative" slot designs, were tested. Slurry film thickness within the pad-wafer interface was measured during polishing using dual emission UV-enhanced fluorescence. Results showed that slurry flow rate, pressure, and pad-wafer rotational rate had impacts on the slurry film thickness. Under the same polishing condition, the ring with the "alternative" slot design generated, on average, 30% thicker slurry film compared with the ring with the "standard" slot design.

Original languageEnglish (US)
JournalElectrochemical and Solid-State Letters
Volume13
Issue number4
DOIs
StatePublished - 2010

Fingerprint

Chemical mechanical polishing
retaining
slots
Film thickness
film thickness
rings
wafers
Polishing
polishing
flow velocity
Fluorescence
Flow rate
fluorescence

ASJC Scopus subject areas

  • Electrochemistry
  • Electrical and Electronic Engineering
  • Materials Science(all)
  • Chemical Engineering(all)
  • Physical and Theoretical Chemistry

Cite this

Effect of retaining ring slot design on slurry film thickness during CMP. / Wei, Xiaomin; Sampurno, Yasa Adi; Zhuang, Yun; Dittler, Roy; Meled, Anand; Cheng, Jiang; Wargo, Christopher; Stankowski, Ralph; Philipossian, Ara.

In: Electrochemical and Solid-State Letters, Vol. 13, No. 4, 2010.

Research output: Contribution to journalArticle

Wei, X, Sampurno, YA, Zhuang, Y, Dittler, R, Meled, A, Cheng, J, Wargo, C, Stankowski, R & Philipossian, A 2010, 'Effect of retaining ring slot design on slurry film thickness during CMP', Electrochemical and Solid-State Letters, vol. 13, no. 4. https://doi.org/10.1149/1.3294496
Wei, Xiaomin ; Sampurno, Yasa Adi ; Zhuang, Yun ; Dittler, Roy ; Meled, Anand ; Cheng, Jiang ; Wargo, Christopher ; Stankowski, Ralph ; Philipossian, Ara. / Effect of retaining ring slot design on slurry film thickness during CMP. In: Electrochemical and Solid-State Letters. 2010 ; Vol. 13, No. 4.
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AU - Cheng, Jiang

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AU - Stankowski, Ralph

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