Effect of slurry application/injection schemes on slurry availability during chemical mechanical planarization (CMP)

Xiaoyan Liao, Yasa Sampurno, Yun Zhuang, Ara Philipossian

Research output: Contribution to journalArticle

9 Scopus citations

Abstract

Effect of slurry applicationinjection schemes on slurry availability during CMP was investigated. A new ultraviolet enhanced fluorescence system was developed to measure slurry film thickness at the retaining ring bow wave for standard pad center area application and novel slurry injection methods. As the novel slurry injection system was placed adjacent to the retaining ring on the pad surface, it generated statistically thicker bow waves (up to 104 percent) in 7 out of 8 cases at different sliding velocities, slurry flow rates and ring pressures, providing more slurry availability for the pad-retaining ring interface. Slurry savings associated with the novel slurry injection system was estimated to range between 8 and 48 percent depending on specific process conditions.

Original languageEnglish (US)
Pages (from-to)H118-H122
JournalElectrochemical and Solid-State Letters
Volume15
Issue number4
DOIs
StatePublished - Feb 27 2012

ASJC Scopus subject areas

  • Chemical Engineering(all)
  • Materials Science(all)
  • Physical and Theoretical Chemistry
  • Electrochemistry
  • Electrical and Electronic Engineering

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