Effect of slurry injection position on slurry mixing, friction, removal rate, and temperature in copper CMP

Yasa Sampurno, Leonard Borucki, Ara Philipossian

Research output: Contribution to journalArticle

13 Citations (Scopus)

Abstract

In this study, the extent of mixing of old and new slurry on the polishing pad is varied by the use of three different points of injection. Influences of the conditioner and bow wave on slurry mixing can be inferred from the experimental results, which include coefficient of friction data and pad and substrate thermal data. Results measured under identical lubrication mechanisms show that the slurry injection position can play a significant role in slurry mixing and slurry utilization efficiency. Slurry injection positions that induce lower slurry mixing are found to increase copper removal rate. Simulations of the bow wave and slurry puddle support the interpretation of the mixing phenomenon. This work underscores the importance of optimum slurry injection geometry and flow for obtaining a more cost effective and environmentally benign copper chemical mechanical polishing (CMP) process.

Original languageEnglish (US)
JournalJournal of the Electrochemical Society
Volume152
Issue number11
DOIs
StatePublished - 2005

Fingerprint

Chemical mechanical polishing
polishing
Copper
friction
Friction
injection
bow waves
copper
Temperature
temperature
lubrication
Polishing
coefficient of friction
Lubrication
costs
Geometry
Substrates
geometry
Costs
simulation

ASJC Scopus subject areas

  • Electrochemistry
  • Surfaces, Coatings and Films
  • Surfaces and Interfaces

Cite this

Effect of slurry injection position on slurry mixing, friction, removal rate, and temperature in copper CMP. / Sampurno, Yasa; Borucki, Leonard; Philipossian, Ara.

In: Journal of the Electrochemical Society, Vol. 152, No. 11, 2005.

Research output: Contribution to journalArticle

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