Effect of temperature on pad surface contact area in chemical mechanical planarization

Y. Jiao, Y. Zhuang, X. Liao, L. J. Borucki, A. Naman, Ara Philipossian

Research output: Contribution to journalArticle

5 Citations (Scopus)

Abstract

In this study, pad surface contact area measurement was performed using laser confocal microscopy at elevated temperatures under dry and static condition to illustrate the effect of temperature on the mechanical contacts in chemical mechanical planarization. Pad surface contact area and contact density were measured for a Cabot Microelectronics Corporation D100 pad sample at 27.6 kPa with a custom-made sample holder that was designed to heat the pad sample during the measurement. When the pad surface temperature increased from 25 to 45°d asperities became much softer and resulted in a significant increase (from 0.029% to 0.092%) in the pad contact area percentage while the contact density remained in the same range.

Original languageEnglish (US)
JournalECS Solid State Letters
Volume1
Issue number2
DOIs
StatePublished - 2012

Fingerprint

Chemical mechanical polishing
Confocal microscopy
Microelectronics
Temperature
Lasers
Industry

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

Cite this

Effect of temperature on pad surface contact area in chemical mechanical planarization. / Jiao, Y.; Zhuang, Y.; Liao, X.; Borucki, L. J.; Naman, A.; Philipossian, Ara.

In: ECS Solid State Letters, Vol. 1, No. 2, 2012.

Research output: Contribution to journalArticle

Jiao, Y. ; Zhuang, Y. ; Liao, X. ; Borucki, L. J. ; Naman, A. ; Philipossian, Ara. / Effect of temperature on pad surface contact area in chemical mechanical planarization. In: ECS Solid State Letters. 2012 ; Vol. 1, No. 2.
@article{67b38fef46cf443eb4348504dc785291,
title = "Effect of temperature on pad surface contact area in chemical mechanical planarization",
abstract = "In this study, pad surface contact area measurement was performed using laser confocal microscopy at elevated temperatures under dry and static condition to illustrate the effect of temperature on the mechanical contacts in chemical mechanical planarization. Pad surface contact area and contact density were measured for a Cabot Microelectronics Corporation D100 pad sample at 27.6 kPa with a custom-made sample holder that was designed to heat the pad sample during the measurement. When the pad surface temperature increased from 25 to 45°d asperities became much softer and resulted in a significant increase (from 0.029{\%} to 0.092{\%}) in the pad contact area percentage while the contact density remained in the same range.",
author = "Y. Jiao and Y. Zhuang and X. Liao and Borucki, {L. J.} and A. Naman and Ara Philipossian",
year = "2012",
doi = "10.1149/2.016202ssl",
language = "English (US)",
volume = "1",
journal = "ECS Solid State Letters",
issn = "2162-8742",
publisher = "The Electrochemical Society",
number = "2",

}

TY - JOUR

T1 - Effect of temperature on pad surface contact area in chemical mechanical planarization

AU - Jiao, Y.

AU - Zhuang, Y.

AU - Liao, X.

AU - Borucki, L. J.

AU - Naman, A.

AU - Philipossian, Ara

PY - 2012

Y1 - 2012

N2 - In this study, pad surface contact area measurement was performed using laser confocal microscopy at elevated temperatures under dry and static condition to illustrate the effect of temperature on the mechanical contacts in chemical mechanical planarization. Pad surface contact area and contact density were measured for a Cabot Microelectronics Corporation D100 pad sample at 27.6 kPa with a custom-made sample holder that was designed to heat the pad sample during the measurement. When the pad surface temperature increased from 25 to 45°d asperities became much softer and resulted in a significant increase (from 0.029% to 0.092%) in the pad contact area percentage while the contact density remained in the same range.

AB - In this study, pad surface contact area measurement was performed using laser confocal microscopy at elevated temperatures under dry and static condition to illustrate the effect of temperature on the mechanical contacts in chemical mechanical planarization. Pad surface contact area and contact density were measured for a Cabot Microelectronics Corporation D100 pad sample at 27.6 kPa with a custom-made sample holder that was designed to heat the pad sample during the measurement. When the pad surface temperature increased from 25 to 45°d asperities became much softer and resulted in a significant increase (from 0.029% to 0.092%) in the pad contact area percentage while the contact density remained in the same range.

UR - http://www.scopus.com/inward/record.url?scp=84880413483&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84880413483&partnerID=8YFLogxK

U2 - 10.1149/2.016202ssl

DO - 10.1149/2.016202ssl

M3 - Article

VL - 1

JO - ECS Solid State Letters

JF - ECS Solid State Letters

SN - 2162-8742

IS - 2

ER -