Effect of temperature on pad surface contact area in chemical mechanical planarization

Yubo Jiao, Yun Zhuang, Zhenxing Han, Xiaoyan Liao, Yasa Adi Sampuno, Ananth Naman, Ara Philipossian

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

In this study, the effect of temperature on pad surface contact area in chemical mechanical planarization was investigated. A custom-made sample holder was designed to heat the pad sample and measure the pad surface contact area under elevated temperatures. Results show that when the pad surface temperature increased from 25 to 35 °C, the contact area percentage increased from 0.029% to 0.051% under the pressure of 4 psi. When the pad surface temperature increased from 35 to 45 °C, the contact area percentage increased further to 0.092%.

Original languageEnglish (US)
Title of host publicationAdvanced Metallization Conference (AMC)
Pages286-287
Number of pages2
StatePublished - 2010
EventAdvanced Metallization Conference 2010 - Albany, NY, United States
Duration: Oct 5 2010Oct 7 2010

Other

OtherAdvanced Metallization Conference 2010
CountryUnited States
CityAlbany, NY
Period10/5/1010/7/10

Fingerprint

Chemical mechanical polishing
Temperature

ASJC Scopus subject areas

  • Materials Science(all)
  • Industrial and Manufacturing Engineering

Cite this

Jiao, Y., Zhuang, Y., Han, Z., Liao, X., Sampuno, Y. A., Naman, A., & Philipossian, A. (2010). Effect of temperature on pad surface contact area in chemical mechanical planarization. In Advanced Metallization Conference (AMC) (pp. 286-287)

Effect of temperature on pad surface contact area in chemical mechanical planarization. / Jiao, Yubo; Zhuang, Yun; Han, Zhenxing; Liao, Xiaoyan; Sampuno, Yasa Adi; Naman, Ananth; Philipossian, Ara.

Advanced Metallization Conference (AMC). 2010. p. 286-287.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Jiao, Y, Zhuang, Y, Han, Z, Liao, X, Sampuno, YA, Naman, A & Philipossian, A 2010, Effect of temperature on pad surface contact area in chemical mechanical planarization. in Advanced Metallization Conference (AMC). pp. 286-287, Advanced Metallization Conference 2010, Albany, NY, United States, 10/5/10.
Jiao Y, Zhuang Y, Han Z, Liao X, Sampuno YA, Naman A et al. Effect of temperature on pad surface contact area in chemical mechanical planarization. In Advanced Metallization Conference (AMC). 2010. p. 286-287
Jiao, Yubo ; Zhuang, Yun ; Han, Zhenxing ; Liao, Xiaoyan ; Sampuno, Yasa Adi ; Naman, Ananth ; Philipossian, Ara. / Effect of temperature on pad surface contact area in chemical mechanical planarization. Advanced Metallization Conference (AMC). 2010. pp. 286-287
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AU - Naman, Ananth

AU - Philipossian, Ara

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AB - In this study, the effect of temperature on pad surface contact area in chemical mechanical planarization was investigated. A custom-made sample holder was designed to heat the pad sample and measure the pad surface contact area under elevated temperatures. Results show that when the pad surface temperature increased from 25 to 35 °C, the contact area percentage increased from 0.029% to 0.051% under the pressure of 4 psi. When the pad surface temperature increased from 35 to 45 °C, the contact area percentage increased further to 0.092%.

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