Effects of disk design and kinematics of conditioners on process hydrodynamics during copper CMP

Zhonglin Li, Hyosang Lee, Len Borucki, Chris Rogers, Ryozo Kikuma, Naoki Rikita, Kenji Nagasawa, Ara Philipossian

Research output: Contribution to journalArticle

17 Citations (Scopus)

Abstract

This study focuses on determining the effect of conditioner disk design, kinematics, and pressure on the slurry distribution under the wafer as measured by the slurry film thickness between the wafer and the pad during actual polishing. Film thicknesses are measured using dual emission UV-enhanced fluorescence, which for thickness measurement requires the slurry to be tagged with two different fluorescent dyes. Results indicate that the wafer is tilted toward the center of the pad and that the extent of wafer tilt is a strong function of conditioning disk pressure. Increasing the oscillation frequency of the conditioner disk or the rotation rate decreases the slurry film thickness and the film thickness increases with slurry flow rate.

Original languageEnglish (US)
JournalJournal of the Electrochemical Society
Volume153
Issue number5
DOIs
StatePublished - 2006

Fingerprint

Cytidine Monophosphate
Film thickness
Copper
Kinematics
film thickness
kinematics
Hydrodynamics
hydrodynamics
wafers
copper
Thickness measurement
conditioning
Polishing
Fluorescent Dyes
polishing
Dyes
flow velocity
dyes
Fluorescence
Flow rate

ASJC Scopus subject areas

  • Electrochemistry
  • Surfaces, Coatings and Films
  • Surfaces and Interfaces

Cite this

Effects of disk design and kinematics of conditioners on process hydrodynamics during copper CMP. / Li, Zhonglin; Lee, Hyosang; Borucki, Len; Rogers, Chris; Kikuma, Ryozo; Rikita, Naoki; Nagasawa, Kenji; Philipossian, Ara.

In: Journal of the Electrochemical Society, Vol. 153, No. 5, 2006.

Research output: Contribution to journalArticle

Li, Zhonglin ; Lee, Hyosang ; Borucki, Len ; Rogers, Chris ; Kikuma, Ryozo ; Rikita, Naoki ; Nagasawa, Kenji ; Philipossian, Ara. / Effects of disk design and kinematics of conditioners on process hydrodynamics during copper CMP. In: Journal of the Electrochemical Society. 2006 ; Vol. 153, No. 5.
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