Abstract
The micro-structures and the phase transformation temperatures of sputtered titanium-nickel (TiNi) thin films, both free-standing and attached on different underlying multilayer substrates have been studied. Differences in the micro-structures, such as the lattice constants and the relative concentrations of TiNi, Ti2Ni and TiNi3 phases, were observed (1) among the free-standing and the attached films, (2) among the films attached on different underlying multi-layers and (3) among films with different relative orders of aging and release. Not surprisingly, the corresponding phase transformation temperatures are also different. It is proposed that both substrate- and process-induced stress significantly affect the micro-structures, hence the phase transformation characteristics, of the resulting shape-memory alloy thin films.
| Original language | English (US) |
|---|---|
| Title of host publication | ASME International Mechanical Engineering Congress and Exposition, Proceedings |
| Pages | 2951-2955 |
| Number of pages | 5 |
| Volume | 2 |
| State | Published - 2001 |
| Externally published | Yes |
| Event | 2001 ASME International Mechanical Engineering Congress and Exposition - New York, NY, United States Duration: Nov 11 2001 → Nov 16 2001 |
Other
| Other | 2001 ASME International Mechanical Engineering Congress and Exposition |
|---|---|
| Country | United States |
| City | New York, NY |
| Period | 11/11/01 → 11/16/01 |
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ASJC Scopus subject areas
- Engineering(all)
Cite this
Effects of Stress Induced by the Underlying Layers on the Micro-Structures and Characteristic Phase Transformation Temperatures of Sputtered TiNi Thin Films. / Wang, Rong Xin; Zohar, Yitshak; Wong, Man.
ASME International Mechanical Engineering Congress and Exposition, Proceedings. Vol. 2 2001. p. 2951-2955.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
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TY - GEN
T1 - Effects of Stress Induced by the Underlying Layers on the Micro-Structures and Characteristic Phase Transformation Temperatures of Sputtered TiNi Thin Films
AU - Wang, Rong Xin
AU - Zohar, Yitshak
AU - Wong, Man
PY - 2001
Y1 - 2001
N2 - The micro-structures and the phase transformation temperatures of sputtered titanium-nickel (TiNi) thin films, both free-standing and attached on different underlying multilayer substrates have been studied. Differences in the micro-structures, such as the lattice constants and the relative concentrations of TiNi, Ti2Ni and TiNi3 phases, were observed (1) among the free-standing and the attached films, (2) among the films attached on different underlying multi-layers and (3) among films with different relative orders of aging and release. Not surprisingly, the corresponding phase transformation temperatures are also different. It is proposed that both substrate- and process-induced stress significantly affect the micro-structures, hence the phase transformation characteristics, of the resulting shape-memory alloy thin films.
AB - The micro-structures and the phase transformation temperatures of sputtered titanium-nickel (TiNi) thin films, both free-standing and attached on different underlying multilayer substrates have been studied. Differences in the micro-structures, such as the lattice constants and the relative concentrations of TiNi, Ti2Ni and TiNi3 phases, were observed (1) among the free-standing and the attached films, (2) among the films attached on different underlying multi-layers and (3) among films with different relative orders of aging and release. Not surprisingly, the corresponding phase transformation temperatures are also different. It is proposed that both substrate- and process-induced stress significantly affect the micro-structures, hence the phase transformation characteristics, of the resulting shape-memory alloy thin films.
UR - http://www.scopus.com/inward/record.url?scp=1542411508&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=1542411508&partnerID=8YFLogxK
M3 - Conference contribution
AN - SCOPUS:1542411508
VL - 2
SP - 2951
EP - 2955
BT - ASME International Mechanical Engineering Congress and Exposition, Proceedings
ER -