Efficient full-wave analysis of packaging interconnects with bends using the method of moments

Zhaohui Zhu, Steven L Dvorak, John L. Prince

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

In this paper, a Method of Moments (MOM) based, Full-Wave Layered Interconnect Simulator, UAFWLIS is extended to handle interconnects with bends. The accuracy of this new bend-cell expansion function is investigated by comparing with Agilent Momentum.

Original languageEnglish (US)
Title of host publicationElectrical Performance of Electronic Packaging
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages363-366
Number of pages4
ISBN (Print)0780381289, 9780780381285
DOIs
StatePublished - 2003
EventElectrical Performance of Electronic Packaging, 2003 - Princeton, United States
Duration: Oct 27 2003Oct 29 2003

Other

OtherElectrical Performance of Electronic Packaging, 2003
CountryUnited States
CityPrinceton
Period10/27/0310/29/03

Fingerprint

Method of moments
Packaging
Momentum
Simulators

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Hardware and Architecture

Cite this

Zhu, Z., Dvorak, S. L., & Prince, J. L. (2003). Efficient full-wave analysis of packaging interconnects with bends using the method of moments. In Electrical Performance of Electronic Packaging (pp. 363-366). [1250069] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/EPEP.2003.1250069

Efficient full-wave analysis of packaging interconnects with bends using the method of moments. / Zhu, Zhaohui; Dvorak, Steven L; Prince, John L.

Electrical Performance of Electronic Packaging. Institute of Electrical and Electronics Engineers Inc., 2003. p. 363-366 1250069.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Zhu, Z, Dvorak, SL & Prince, JL 2003, Efficient full-wave analysis of packaging interconnects with bends using the method of moments. in Electrical Performance of Electronic Packaging., 1250069, Institute of Electrical and Electronics Engineers Inc., pp. 363-366, Electrical Performance of Electronic Packaging, 2003, Princeton, United States, 10/27/03. https://doi.org/10.1109/EPEP.2003.1250069
Zhu Z, Dvorak SL, Prince JL. Efficient full-wave analysis of packaging interconnects with bends using the method of moments. In Electrical Performance of Electronic Packaging. Institute of Electrical and Electronics Engineers Inc. 2003. p. 363-366. 1250069 https://doi.org/10.1109/EPEP.2003.1250069
Zhu, Zhaohui ; Dvorak, Steven L ; Prince, John L. / Efficient full-wave analysis of packaging interconnects with bends using the method of moments. Electrical Performance of Electronic Packaging. Institute of Electrical and Electronics Engineers Inc., 2003. pp. 363-366
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