Efficient full-wave analysis of packaging interconnects with bends using the method of moments

Zhaohui Zhu, Steven L Dvorak, John L. Prince

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

In this paper, a Method of Moments (MOM) based, Full-Wave Layered Interconnect Simulator, UAFWLIS is extended to handle interconnects with bends. The accuracy of this new bend-cell expansion function is investigated by comparing with Agilent Momentum.

Original languageEnglish (US)
Title of host publicationElectrical Performance of Electronic Packaging
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages363-366
Number of pages4
ISBN (Print)0780381289, 9780780381285
DOIs
StatePublished - 2003
EventElectrical Performance of Electronic Packaging, 2003 - Princeton, United States
Duration: Oct 27 2003Oct 29 2003

Other

OtherElectrical Performance of Electronic Packaging, 2003
CountryUnited States
CityPrinceton
Period10/27/0310/29/03

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Hardware and Architecture

Fingerprint Dive into the research topics of 'Efficient full-wave analysis of packaging interconnects with bends using the method of moments'. Together they form a unique fingerprint.

Cite this