Electrical package impact on VCSEL-based optical interconnects

Ravi Pant, Mark A Neifeld, Michael B. Steer, Houssam Kanj, Andreas Cangellaris

Research output: Contribution to journalArticle

1 Citation (Scopus)

Abstract

A new CAD tool fREEDA ® based on state variable approach and universal error concept is presented for modelling and simulating systems where physical domains such as electrical, thermal, and optical interact with each other. A single implementation of device equations in fREEDA ® can be used with different analysis types such as transient and harmonic balance, etc. To demonstrate the multi-physics capabilities of fREEDA ®, we present a study of the impact of electrical packages on the source module performance in multi-gigabit per second vertical cavity surface emitting laser (VCSEL)-based optical interconnects. The effect of various operating conditions such as bias/drive level and driver configuration are studied. We consider electrical packages such as printed wire board, thin-film and flip-chip in our study. A comparison of VCSELs with stripe lasers is also presented.

Original languageEnglish (US)
Pages (from-to)315-332
Number of pages18
JournalOptics Communications
Volume245
Issue number1-6
DOIs
StatePublished - Jan 17 2005

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optical interconnects
Optical interconnects
Surface emitting lasers
surface emitting lasers
cavities
computer aided design
Computer aided design
Physics
modules
chips
wire
Wire
harmonics
Thin films
physics
Lasers
thin films
configurations
lasers
Hot Temperature

Keywords

  • Optical interconnects
  • Packaging
  • Simulation
  • VCSELs

ASJC Scopus subject areas

  • Atomic and Molecular Physics, and Optics

Cite this

Electrical package impact on VCSEL-based optical interconnects. / Pant, Ravi; Neifeld, Mark A; Steer, Michael B.; Kanj, Houssam; Cangellaris, Andreas.

In: Optics Communications, Vol. 245, No. 1-6, 17.01.2005, p. 315-332.

Research output: Contribution to journalArticle

Pant, Ravi ; Neifeld, Mark A ; Steer, Michael B. ; Kanj, Houssam ; Cangellaris, Andreas. / Electrical package impact on VCSEL-based optical interconnects. In: Optics Communications. 2005 ; Vol. 245, No. 1-6. pp. 315-332.
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