Electrical package impact on VCSEL-based optical interconnects

Ravi Pant; Mark A. Neifeld; Michael B. Steer; Houssam Kanj; Andreas Cangellaris

doi:10.1016/j.optcom.2004.10.017

Electrical package impact on VCSEL-based optical interconnects

Ravi Pant, Mark A. Neifeld, Michael B. Steer, Houssam Kanj, Andreas Cangellaris

Electrical and Computer Engineering

Research output: Contribution to journal › Article › peer-review

1 Scopus citations

Abstract

A new CAD tool fREEDA ^® based on state variable approach and universal error concept is presented for modelling and simulating systems where physical domains such as electrical, thermal, and optical interact with each other. A single implementation of device equations in fREEDA ^® can be used with different analysis types such as transient and harmonic balance, etc. To demonstrate the multi-physics capabilities of fREEDA ^®, we present a study of the impact of electrical packages on the source module performance in multi-gigabit per second vertical cavity surface emitting laser (VCSEL)-based optical interconnects. The effect of various operating conditions such as bias/drive level and driver configuration are studied. We consider electrical packages such as printed wire board, thin-film and flip-chip in our study. A comparison of VCSELs with stripe lasers is also presented.

Original language	English (US)
Pages (from-to)	315-332
Number of pages	18
Journal	Optics Communications
Volume	245
Issue number	1-6
DOIs	https://doi.org/10.1016/j.optcom.2004.10.017
State	Published - Jan 17 2005

Keywords

Optical interconnects
Packaging
Simulation
VCSELs

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Atomic and Molecular Physics, and Optics
Physical and Theoretical Chemistry
Electrical and Electronic Engineering

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10.1016/j.optcom.2004.10.017

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@article{70f35f515c7a4178a53272e5e5cab79e,

title = "Electrical package impact on VCSEL-based optical interconnects",

abstract = "A new CAD tool fREEDA {\textregistered} based on state variable approach and universal error concept is presented for modelling and simulating systems where physical domains such as electrical, thermal, and optical interact with each other. A single implementation of device equations in fREEDA {\textregistered} can be used with different analysis types such as transient and harmonic balance, etc. To demonstrate the multi-physics capabilities of fREEDA {\textregistered}, we present a study of the impact of electrical packages on the source module performance in multi-gigabit per second vertical cavity surface emitting laser (VCSEL)-based optical interconnects. The effect of various operating conditions such as bias/drive level and driver configuration are studied. We consider electrical packages such as printed wire board, thin-film and flip-chip in our study. A comparison of VCSELs with stripe lasers is also presented.",

keywords = "Optical interconnects, Packaging, Simulation, VCSELs",

author = "Ravi Pant and Neifeld, {Mark A.} and Steer, {Michael B.} and Houssam Kanj and Andreas Cangellaris",

year = "2005",

month = jan,

day = "17",

doi = "10.1016/j.optcom.2004.10.017",

language = "English (US)",

volume = "245",

pages = "315--332",

journal = "Optics Communications",

issn = "0030-4018",

publisher = "Elsevier",

number = "1-6",

}

TY - JOUR

T1 - Electrical package impact on VCSEL-based optical interconnects

AU - Pant, Ravi

AU - Neifeld, Mark A.

AU - Steer, Michael B.

AU - Kanj, Houssam

AU - Cangellaris, Andreas

PY - 2005/1/17

Y1 - 2005/1/17

N2 - A new CAD tool fREEDA ® based on state variable approach and universal error concept is presented for modelling and simulating systems where physical domains such as electrical, thermal, and optical interact with each other. A single implementation of device equations in fREEDA ® can be used with different analysis types such as transient and harmonic balance, etc. To demonstrate the multi-physics capabilities of fREEDA ®, we present a study of the impact of electrical packages on the source module performance in multi-gigabit per second vertical cavity surface emitting laser (VCSEL)-based optical interconnects. The effect of various operating conditions such as bias/drive level and driver configuration are studied. We consider electrical packages such as printed wire board, thin-film and flip-chip in our study. A comparison of VCSELs with stripe lasers is also presented.

AB - A new CAD tool fREEDA ® based on state variable approach and universal error concept is presented for modelling and simulating systems where physical domains such as electrical, thermal, and optical interact with each other. A single implementation of device equations in fREEDA ® can be used with different analysis types such as transient and harmonic balance, etc. To demonstrate the multi-physics capabilities of fREEDA ®, we present a study of the impact of electrical packages on the source module performance in multi-gigabit per second vertical cavity surface emitting laser (VCSEL)-based optical interconnects. The effect of various operating conditions such as bias/drive level and driver configuration are studied. We consider electrical packages such as printed wire board, thin-film and flip-chip in our study. A comparison of VCSELs with stripe lasers is also presented.

KW - Optical interconnects

KW - Packaging

KW - Simulation

KW - VCSELs

UR - http://www.scopus.com/inward/record.url?scp=11444267295&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=11444267295&partnerID=8YFLogxK

U2 - 10.1016/j.optcom.2004.10.017

DO - 10.1016/j.optcom.2004.10.017

M3 - Article

AN - SCOPUS:11444267295

VL - 245

SP - 315

EP - 332

JO - Optics Communications

JF - Optics Communications

SN - 0030-4018

IS - 1-6

ER -