Electrical package impact on VCSEL-based optical interconnects

Ravi Pant, Mark A. Neifeld, Michael B. Steer, Houssam Kanj, Andreas Cangellaris

Research output: Contribution to journalArticle

1 Scopus citations

Abstract

A new CAD tool fREEDA ® based on state variable approach and universal error concept is presented for modelling and simulating systems where physical domains such as electrical, thermal, and optical interact with each other. A single implementation of device equations in fREEDA ® can be used with different analysis types such as transient and harmonic balance, etc. To demonstrate the multi-physics capabilities of fREEDA ®, we present a study of the impact of electrical packages on the source module performance in multi-gigabit per second vertical cavity surface emitting laser (VCSEL)-based optical interconnects. The effect of various operating conditions such as bias/drive level and driver configuration are studied. We consider electrical packages such as printed wire board, thin-film and flip-chip in our study. A comparison of VCSELs with stripe lasers is also presented.

Original languageEnglish (US)
Pages (from-to)315-332
Number of pages18
JournalOptics Communications
Volume245
Issue number1-6
DOIs
StatePublished - Jan 17 2005

Keywords

  • Optical interconnects
  • Packaging
  • Simulation
  • VCSELs

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Atomic and Molecular Physics, and Optics
  • Physical and Theoretical Chemistry
  • Electrical and Electronic Engineering

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