Electrical packaging impact on source components in optical interconnects

M. A. Neifeld, Wu Chun Chou

Research output: Contribution to conferencePaperpeer-review

Abstract

A simulation study of optical interconnects is described. Influences of electrical packaging technologies on laser source performance is evaluated. Various laser and driver types are considered together with ceramic board, film carrier and flip-chip connections.

Original languageEnglish (US)
Pages235-238
Number of pages4
StatePublished - Dec 1 1994
EventProceedings of the 3rd Topical Meeting on Electrical Performance of Electronic Packaging - Monterey, CA, USA
Duration: Nov 2 1994Nov 4 1994

Other

OtherProceedings of the 3rd Topical Meeting on Electrical Performance of Electronic Packaging
CityMonterey, CA, USA
Period11/2/9411/4/94

ASJC Scopus subject areas

  • Engineering(all)

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