Electrical performance evaluation for multi-chip assemblies using knowledge based approach

Pochang Hsu, R. Senthinathan, J. W. Rozenblit, John L. Prince

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Scopus citations

Abstract

In this paper, preliminary work on electrical performance estimation and evaluation for multi-chip assemblies (i.e., multi-chip modules, chip on board, and etc.) is presented. A knowledge base is built to facilitate system performance merits evaluation process. Even though many other parameters can be included in the performance merit set, at this stage only electrical performance merits such as module frequency, module size and power dissipation are modeled. The other performance merits (e.g., cost estimation, thermal resistance and reliability, and etc.) are to be included in future work.

Original languageEnglish (US)
Title of host publicationElectrical Performance of Electronic Packaging, EPEP 1992
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages7-9
Number of pages3
ISBN (Electronic)078030683X, 9780780306837
DOIs
StatePublished - Jan 1 1992
Event1992 Electrical Performance of Electronic Packaging, EPEP 1992 - Tucson, United States
Duration: Apr 22 1992Apr 24 1992

Publication series

NameElectrical Performance of Electronic Packaging, EPEP 1992

Conference

Conference1992 Electrical Performance of Electronic Packaging, EPEP 1992
CountryUnited States
CityTucson
Period4/22/924/24/92

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Safety, Risk, Reliability and Quality
  • Electronic, Optical and Magnetic Materials

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  • Cite this

    Hsu, P., Senthinathan, R., Rozenblit, J. W., & Prince, J. L. (1992). Electrical performance evaluation for multi-chip assemblies using knowledge based approach. In Electrical Performance of Electronic Packaging, EPEP 1992 (pp. 7-9). [572250] (Electrical Performance of Electronic Packaging, EPEP 1992). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/EPEP.1992.572250