Electrochemical mechanical removal of Ta films in dihydroxybenzene sulfonic acid solutions containing potassium iodate

R. Govindarajan, S. Siddiqui, Manish K Keswani, Srini Raghavan, D. R P Singh, N. Chawla

Research output: Contribution to journalArticle

3 Citations (Scopus)

Abstract

Removal of Ta films has been investigated in solutions containing 2,5 dihydroxy benzene sulfonic acid and potassium iodate (KIO3) under conditions that exist during electrochemical mechanical polishing. Specifically, the films were abraded at low pressures (∼0.5 psi) on a polyurethane pad under galvanostatic conditions. Variables such as pH, KIO3 concentration, and current density have been investigated to develop an optimized formulation. The nature of the oxide film formed on tantalum during the electrochemical abrasion process was investigated using x-ray photoelectron spectroscopy and nanoindentation techniques.

Original languageEnglish (US)
JournalElectrochemical and Solid-State Letters
Volume14
Issue number4
DOIs
StatePublished - 2011

Fingerprint

iodates
Sulfonic Acids
sulfonic acid
Potassium
potassium
Tantalum
Polyurethanes
Acids
abrasion
Nanoindentation
Photoelectron spectroscopy
tantalum
nanoindentation
Benzene
Polishing
polishing
Abrasion
x ray spectroscopy
Oxide films
oxide films

ASJC Scopus subject areas

  • Electrochemistry
  • Electrical and Electronic Engineering
  • Materials Science(all)
  • Chemical Engineering(all)
  • Physical and Theoretical Chemistry

Cite this

Electrochemical mechanical removal of Ta films in dihydroxybenzene sulfonic acid solutions containing potassium iodate. / Govindarajan, R.; Siddiqui, S.; Keswani, Manish K; Raghavan, Srini; Singh, D. R P; Chawla, N.

In: Electrochemical and Solid-State Letters, Vol. 14, No. 4, 2011.

Research output: Contribution to journalArticle

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AU - Singh, D. R P

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