A wet chip electro-fluidic packaging technology based on electroplating is described. An electroplated gold seal provides the sensor's fluid connection to a silicon multi-chip module. A hermetic seal is obtained using the gold-silicon eutectic bond. The sensor's electrical connections to the multi-chip module are made by eutectic bonding electroplated gold-tin solder bumps on the sensor to gold pads on the substrate. The fluid and electrical connections are made simultaneously, and the process is compatible with the flip-chip bonding technique.
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics
- Surfaces, Coatings and Films
- Metals and Alloys
- Electrical and Electronic Engineering