Electroplated electro-fluidic interconnects for chemical sensors

Eniko T. Enikov, James G. Boyd

Research output: Contribution to journalArticle

7 Scopus citations

Abstract

A wet chip electro-fluidic packaging technology based on electroplating is described. An electroplated gold seal provides the sensor's fluid connection to a silicon multi-chip module. A hermetic seal is obtained using the gold-silicon eutectic bond. The sensor's electrical connections to the multi-chip module are made by eutectic bonding electroplated gold-tin solder bumps on the sensor to gold pads on the substrate. The fluid and electrical connections are made simultaneously, and the process is compatible with the flip-chip bonding technique.

Original languageEnglish (US)
Pages (from-to)161-164
Number of pages4
JournalSensors and Actuators, A: Physical
Volume84
Issue number1
DOIs
StatePublished - Aug 1 2000
Externally publishedYes

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Instrumentation
  • Condensed Matter Physics
  • Surfaces, Coatings and Films
  • Metals and Alloys
  • Electrical and Electronic Engineering

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