Electroplated electro-fluidic interconnects for chemical sensors

Eniko T Enikov, James G. Boyd

Research output: Contribution to journalArticle

7 Citations (Scopus)

Abstract

A wet chip electro-fluidic packaging technology based on electroplating is described. An electroplated gold seal provides the sensor's fluid connection to a silicon multi-chip module. A hermetic seal is obtained using the gold-silicon eutectic bond. The sensor's electrical connections to the multi-chip module are made by eutectic bonding electroplated gold-tin solder bumps on the sensor to gold pads on the substrate. The fluid and electrical connections are made simultaneously, and the process is compatible with the flip-chip bonding technique.

Original languageEnglish (US)
Pages (from-to)161-164
Number of pages4
JournalSensors and Actuators, A: Physical
Volume84
Issue number1
DOIs
StatePublished - Aug 1 2000
Externally publishedYes

Fingerprint

fluidics
Fluidics
Chemical sensors
Gold
chips
gold
sensors
Silicon
eutectics
Eutectics
Sensors
hermetic seals
Hermetic seals
modules
Fluids
Tin
fluids
electroplating
Electroplating
silicon

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Mechanical Engineering
  • Instrumentation

Cite this

Electroplated electro-fluidic interconnects for chemical sensors. / Enikov, Eniko T; Boyd, James G.

In: Sensors and Actuators, A: Physical, Vol. 84, No. 1, 01.08.2000, p. 161-164.

Research output: Contribution to journalArticle

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