The moisture inside the IC packages induces the several deformation failures, such as popcorn crack and swelling during the solder reflowing process. In semiconductor industry, over the past few years, the equivalent acceleration time for JEDEC moisture sensitivity level has been updated based on the weight gain measurements when the package structure and materials were modified. It costs long test times which may induce the significant delay of new product development and reliability evaluation. Additionally, the weight gain equivalency may not be sufficient to determine the equivalent accelerated time. In this paper, the new approach for evaluating the equivalent acceleration test time for preconditioning is proposed using the numerical calculation by peridynamics (PD) theory. The essential of proposed method is analyzing a moisture concentration and a vapor pressure which can cause the moisture induced failure in IC packages without facing the discontinuity problems of moisture concentration along the interfaces.