Equivalent acceleration assessment of JEDEC moisture sensitivity levels using peridynamics

Sungwon Han, Seyoung Lim, Jangyoung Bae, Yuchul Hwang, Sungsoo Lee, Selda Oterkus, Erdogan Madenci, Cagan Diyaroglu, Erkan Oterkus

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)

Abstract

The moisture inside the IC packages induces the several deformation failures, such as popcorn crack and swelling during the solder reflowing process. In semiconductor industry, over the past few years, the equivalent acceleration time for JEDEC moisture sensitivity level has been updated based on the weight gain measurements when the package structure and materials were modified. It costs long test times which may induce the significant delay of new product development and reliability evaluation. Additionally, the weight gain equivalency may not be sufficient to determine the equivalent accelerated time. In this paper, the new approach for evaluating the equivalent acceleration test time for preconditioning is proposed using the numerical calculation by peridynamics (PD) theory. The essential of proposed method is analyzing a moisture concentration and a vapor pressure which can cause the moisture induced failure in IC packages without facing the discontinuity problems of moisture concentration along the interfaces.

Original languageEnglish (US)
Title of host publicationProceedings - Electronic Components and Technology Conference
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1518-1523
Number of pages6
Volume2015-July
ISBN (Print)9781479986095
DOIs
StatePublished - Jul 15 2015
Event2015 65th IEEE Electronic Components and Technology Conference, ECTC 2015 - San Diego, United States
Duration: May 26 2015May 29 2015

Other

Other2015 65th IEEE Electronic Components and Technology Conference, ECTC 2015
CountryUnited States
CitySan Diego
Period5/26/155/29/15

Fingerprint

Moisture
Gain measurement
Weighing
Vapor pressure
Product development
Soldering alloys
Swelling
Semiconductor materials
Cracks
Costs
Industry

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

Cite this

Han, S., Lim, S., Bae, J., Hwang, Y., Lee, S., Oterkus, S., ... Oterkus, E. (2015). Equivalent acceleration assessment of JEDEC moisture sensitivity levels using peridynamics. In Proceedings - Electronic Components and Technology Conference (Vol. 2015-July, pp. 1518-1523). [7159799] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ECTC.2015.7159799

Equivalent acceleration assessment of JEDEC moisture sensitivity levels using peridynamics. / Han, Sungwon; Lim, Seyoung; Bae, Jangyoung; Hwang, Yuchul; Lee, Sungsoo; Oterkus, Selda; Madenci, Erdogan; Diyaroglu, Cagan; Oterkus, Erkan.

Proceedings - Electronic Components and Technology Conference. Vol. 2015-July Institute of Electrical and Electronics Engineers Inc., 2015. p. 1518-1523 7159799.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Han, S, Lim, S, Bae, J, Hwang, Y, Lee, S, Oterkus, S, Madenci, E, Diyaroglu, C & Oterkus, E 2015, Equivalent acceleration assessment of JEDEC moisture sensitivity levels using peridynamics. in Proceedings - Electronic Components and Technology Conference. vol. 2015-July, 7159799, Institute of Electrical and Electronics Engineers Inc., pp. 1518-1523, 2015 65th IEEE Electronic Components and Technology Conference, ECTC 2015, San Diego, United States, 5/26/15. https://doi.org/10.1109/ECTC.2015.7159799
Han S, Lim S, Bae J, Hwang Y, Lee S, Oterkus S et al. Equivalent acceleration assessment of JEDEC moisture sensitivity levels using peridynamics. In Proceedings - Electronic Components and Technology Conference. Vol. 2015-July. Institute of Electrical and Electronics Engineers Inc. 2015. p. 1518-1523. 7159799 https://doi.org/10.1109/ECTC.2015.7159799
Han, Sungwon ; Lim, Seyoung ; Bae, Jangyoung ; Hwang, Yuchul ; Lee, Sungsoo ; Oterkus, Selda ; Madenci, Erdogan ; Diyaroglu, Cagan ; Oterkus, Erkan. / Equivalent acceleration assessment of JEDEC moisture sensitivity levels using peridynamics. Proceedings - Electronic Components and Technology Conference. Vol. 2015-July Institute of Electrical and Electronics Engineers Inc., 2015. pp. 1518-1523
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