Etch Rate of Silicon and Silicon Dioxide in Ammonia-Peroxide Solutions Measured by Quartz Crystal Microbalance Technique

Kyeong T. Lee, Srini Raghavan

Research output: Contribution to journalArticlepeer-review

14 Scopus citations

Abstract

The etch rate of sputter coated silicon and thermally grown silica in ammonia-peroxide and ammonia solutions has been investigated using a quartz crystal microbalance (QCM) technique. The results obtained have been compared with literature results using more conventional techniques to show that a QCM is a valuable in situ measurement technique to follow very small etch rates.

Original languageEnglish (US)
Pages (from-to)172-174
Number of pages3
JournalElectrochemical and Solid-State Letters
Volume2
Issue number2-4
DOIs
StatePublished - Apr 1999

ASJC Scopus subject areas

  • Chemical Engineering(all)
  • Materials Science(all)
  • Physical and Theoretical Chemistry
  • Electrochemistry
  • Electrical and Electronic Engineering

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