Evaluation of inhibitors for ECMP of copper using Electrochemical Quartz Crystal Microbalance (EQCM) technique

Ashok Muthukumaran, Viral Lowalekar, Srini Raghavan

Research output: Contribution to journalConference article

6 Scopus citations

Abstract

Chemical formulations for the electrochemical mechanical planarization (ECMP) of copper must contain constituents that are stable at anodic potentials. A key component of the formulation is a corrosion inhibitor, which is required to protect low lying areas while higher areas are selectively removed. Organic compounds, which adsorb on copper at low overpotentials and form a film by oxidation at higher overpotentials, may be particularly useful for ECMP. The objective of this work is to evaluate the effect of two inhibitors on copper dissolution in oxalic acid based systems using an electrochemical quartz crystal microbalance (EQCM) technique. By recording current as well as mass changes during the application of potential to electrodeposited copper films, the extent and mechanism of inhibition of sulfhydryl-based acid (SB A) inhibitor has been explored.

Original languageEnglish (US)
Pages (from-to)231-236
Number of pages6
JournalMaterials Research Society Symposium Proceedings
Volume914
DOIs
StatePublished - Jan 1 2006
Event2006 MRS Spring Meeting - San Francisco, CA, United States
Duration: Apr 17 2006Apr 21 2006

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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