Evaluation of sulfonic acid-based solutions for electrochemical mechanical removal of tantalum

A. Muthukumaran, N. Venkataraman, S. Raghavan

Research output: Contribution to journalArticle

6 Scopus citations

Abstract

A fundamental study was undertaken to evaluate the usefulness of a sulfonic acid-based chemical system for the removal of tantalum under electrochemical mechanical planarization conditions. Tantalum as well as copper samples were polished at low pressures (∼0.5 psi) under galvanostatic conditions in dihydroxy benzene sulfonic acid (DBSA) solutions maintained at different pH values. At a current density of 0.5 mA cm2 and pH 10, tantalum removal rate of ∼200 Åmin with a 1:1 selectivity to copper has been obtained in 0.3 M DBSA solutions containing 1.2 M H2 O2. The presence of a small amount (∼0.1%) of colloidal silica particles is required to obtain good removal rates.

Original languageEnglish (US)
Pages (from-to)H184-H187
JournalJournal of the Electrochemical Society
Volume155
Issue number3
DOIs
StatePublished - Jan 29 2008

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Renewable Energy, Sustainability and the Environment
  • Surfaces, Coatings and Films
  • Electrochemistry
  • Materials Chemistry

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