Experimental and simulation investigations of acoustic cavitation in megasonic cleaning

Krishna Muralidharan, Manish Keswani, Hrishikesh Shende, Pierre Deymier, Srini Raghavan, Florence Eschbach, Archita Sengupta

Research output: Contribution to journalConference article

9 Scopus citations

Abstract

Extreme ultra-violet (EUV) lithography has become the technique of choice to print the ever-shrinking nanoscale features on the silicon wafer. For successful transfer of patterns on to the wafer, the EUV photomask cannot contain defects greater than 30 nm. Megasonic cleaning is a very successful cleaning technique for removal of particles on photomasks, but also causes a relatively high amount of damage to the fragile EUV photomasks thin film structures. Though it is believed that acoustic cavitation is the primary phenomenon responsible for cleaning as well as pattern damage, a fundamental picture of the acoustic cavitation mechanisms in play during megasonic cleaning has not yet clearly emerged. In this study, we characterize the role of acoustic cavitation in megasonic cleaning by examining the effects of acoustic power densities, cleaning solution properties, and dissolved gas content on cavitation via experiments and molecular dynamics (MD) simulations. MD is an atomistic computation technique capable of modeling atomic-level and nanoscale processes accurately making it well suited to study the effect of cavitation on nano-sized particles and patterns.

Original languageEnglish (US)
Article number65171E
JournalProceedings of SPIE - The International Society for Optical Engineering
Volume6517
Issue numberPART 1
DOIs
StatePublished - Oct 15 2007
EventEmerging Lithographic Technologies XI - San Jose, CA, United States
Duration: Feb 27 2007Mar 1 2007

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

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