Experimental and theoretical investigation of slurry chemical and mechanical characteristics in copper polishing

Y. Zhuang, M. Keswani, L. Borucki, R. Zhuang, M. Lacy, C. Spiro, A. Philipossian

Research output: Contribution to conferencePaper

Abstract

Mechanical and chemical rate characteristics of Cabot Microelectronics Corporation iCue 600Y75 and iCue EP-C7092 slurries are examined in this study on IC1000 K-groove pads. Copper polishing was performed on a 200 mm Fujikoshi polisher at polishing pressures of 1, 2 and 3 PSI and sliding velocities of 0.3, 0.75 and 1.2 m/sec. Two slurry flow rates (120 and 200 ml/min) were used. During polishing, the coefficient of friction was measured in real time and the pad leading edge temperature was measured with an IR camera. Data were subsequently modeled with a two-step chemical-mechanical removal rate model in which the reaction temperature is attributed in part to flash heating of asperities involved in pad/wafer contact. The model provides separate estimates of the chemical and mechanical rates. It was assumed that the pre-exponential factor in the Arrhenius expression for the chemical rate depends only on the slurry type and that the flash heating parameters are related only to the pad material properties. A proportionality constant in the mechanical rate, similar to a Preston coefficient, was allowed to vary independently for each slurry/pad/flow rate combination. This constrained and structured model analysis describes the observed non-Prestonian copper removal rates very well.

Original languageEnglish (US)
Pages395-400
Number of pages6
StatePublished - Dec 1 2006
Event11th International Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference, CMP-MIC 2006 - Fremont, CA, United States
Duration: Feb 21 2006Feb 23 2006

Other

Other11th International Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference, CMP-MIC 2006
CountryUnited States
CityFremont, CA
Period2/21/062/23/06

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering

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  • Cite this

    Zhuang, Y., Keswani, M., Borucki, L., Zhuang, R., Lacy, M., Spiro, C., & Philipossian, A. (2006). Experimental and theoretical investigation of slurry chemical and mechanical characteristics in copper polishing. 395-400. Paper presented at 11th International Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference, CMP-MIC 2006, Fremont, CA, United States.