Experimental investigation and numerical simulation of pad stain formation during copper CMP

Lee Hyosang, Zhuang Yun, Leonard Borucki, Fergal O'Moore, Joh Sooyun, Ara Philipossian

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Experiments and simulations were performed to investigate the characteristics of staining on pad surface. Experiments were performed on a table-top axisymmetric polishing system, consisting of a 12-inch non-rotating platen and a 4-inch rotating wafer carrier. Stain deposited on each land area was found to be darker in the direction of wafer rotation and in the radial direction, suggesting that the staining agent was produced by mechanical action during polishing and subsequently was advected downstream by slurry flow. While staining increased with polishing pressure, wafer rotation rate and polishing time, it did not seem to affect removal rate. Slurry velocity simulations showed shear flow on the land areas and wafer-driven circulation in the grooves. Temperature simulations showed a 12 °C rise in the reaction temperature on the surface of the copper wafer. Simulated stain images were in qualitative agreement with experimental results.

Original languageEnglish (US)
Title of host publicationMaterials Research Society Symposium Proceedings
Pages165-170
Number of pages6
Volume991
StatePublished - 2007
Event2007 MRS Spring Meeting - San Francisco, CA, United States
Duration: Apr 10 2007Apr 12 2007

Other

Other2007 MRS Spring Meeting
CountryUnited States
CitySan Francisco, CA
Period4/10/074/12/07

Fingerprint

Cytidine Monophosphate
Polishing
Copper
Coloring Agents
Computer simulation
Shear flow
Experiments
Temperature
Direction compound

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials

Cite this

Hyosang, L., Yun, Z., Borucki, L., O'Moore, F., Sooyun, J., & Philipossian, A. (2007). Experimental investigation and numerical simulation of pad stain formation during copper CMP. In Materials Research Society Symposium Proceedings (Vol. 991, pp. 165-170)

Experimental investigation and numerical simulation of pad stain formation during copper CMP. / Hyosang, Lee; Yun, Zhuang; Borucki, Leonard; O'Moore, Fergal; Sooyun, Joh; Philipossian, Ara.

Materials Research Society Symposium Proceedings. Vol. 991 2007. p. 165-170.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Hyosang, L, Yun, Z, Borucki, L, O'Moore, F, Sooyun, J & Philipossian, A 2007, Experimental investigation and numerical simulation of pad stain formation during copper CMP. in Materials Research Society Symposium Proceedings. vol. 991, pp. 165-170, 2007 MRS Spring Meeting, San Francisco, CA, United States, 4/10/07.
Hyosang L, Yun Z, Borucki L, O'Moore F, Sooyun J, Philipossian A. Experimental investigation and numerical simulation of pad stain formation during copper CMP. In Materials Research Society Symposium Proceedings. Vol. 991. 2007. p. 165-170
Hyosang, Lee ; Yun, Zhuang ; Borucki, Leonard ; O'Moore, Fergal ; Sooyun, Joh ; Philipossian, Ara. / Experimental investigation and numerical simulation of pad stain formation during copper CMP. Materials Research Society Symposium Proceedings. Vol. 991 2007. pp. 165-170
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