Experimental investigation of solid immersion lens lithography

Tao Chen, Thomas D Milster, Dongseok Nam, Seung Hune Yang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Scopus citations


There are several next generation technologies for high resolution lithography, such as ArF wet immersion, F2, EUV, etc. However, these technologies are very expensive because of projection lens and mask costs. Near-field optics using a solid immersion lens (SIL) can meet the requirement of high resolution in a cost-effective way. In this paper, a very compact and inexpensive high resolution system using a SIL is introduced and preliminary experimental results are presented using a 405nm laser diode system. The SIL is used with a modified conventional inverted microscope. The air gap between the SIL flat bottom surface and the wafer is kept less than 50nm. Optical reflected power from SIL bottom and wafer interface is used to control the gap. A high resolution experiment with 405nm wavelength is discussed.

Original languageEnglish (US)
Title of host publicationProceedings of SPIE - The International Society for Optical Engineering
EditorsB.W. Smith
Number of pages8
EditionPART 1
Publication statusPublished - 2005
EventOptical Microlithography XVIII - San Jose, CA, United States
Duration: Mar 1 2005Mar 4 2005


OtherOptical Microlithography XVIII
CountryUnited States
CitySan Jose, CA



  • Lithography
  • Near-field optics
  • Solid immersion lens

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Condensed Matter Physics

Cite this

Chen, T., Milster, T. D., Nam, D., & Yang, S. H. (2005). Experimental investigation of solid immersion lens lithography. In B. W. Smith (Ed.), Proceedings of SPIE - The International Society for Optical Engineering (PART 1 ed., Vol. 5754, pp. 254-261). [25] https://doi.org/10.1117/12.600065