Experimental validation of hygro/thermo-mechanical simulations for multi-material polymer structures

J. J. Kirk, J. L. Tor, I. Guven, E. Madenci, A. Mertol, Z. Kutlu

Research output: Contribution to journalConference article

Abstract

By comparing against in-house experimental measurements, this study evaluates the numerical simulations of hygro/thermo-mechanical deformations in polymer structures commonly used in electronic packages The simulations are achieved by using the finite element method (FEM). Two different material characterization techniques are utilized for displacements and/or strains due to both moisture and thermal loading.

Original languageEnglish (US)
Pages (from-to)883-889
Number of pages7
JournalProceedings - Electronic Components and Technology Conference
Volume1
StatePublished - Dec 27 2004
Event2004 Proceedings - 54th Electronic Components and Technology Conference - Las Vegas, NV, United States
Duration: Jun 1 2004Jun 4 2004

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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