Extending the flash heating removal rate model to various interlayer dielectric CMP consumables

Jamshid Sorooshian, Ara Philipossian

Research output: Contribution to journalArticle

Abstract

This study extends the application of a previously presented flash heating removal rate model to a series of interlayer dielectric (ILD) chemical mechanical planarization (CMP) experiments using Freudenberg XY and perforated groove pads along with Fujimi PL-4217 fumed silica slurry. Polishing tests were conducted at platen temperatures ranging from approximately 24 to 45°C, Application of the model indicates its versatility when using different tool sets, pad types, and slurry chemistries compared to those originally used to develop the model. The flash heating removal rate model was shown to predict experimental data from this study by an average root mean square (rms) error of 164 Å/min. When compared to the traditional Preston model, which predicted the data by an average rms of 300 Å/min, the flash heating model provides better predictive accuracy and enables one to predict previously assumed scatter associated with removal rate in a systematic and comprehensible manner.

Original languageEnglish (US)
JournalJournal of the Electrochemical Society
Volume152
Issue number12
DOIs
Publication statusPublished - 2005
Externally publishedYes

    Fingerprint

ASJC Scopus subject areas

  • Electrochemistry
  • Surfaces, Coatings and Films
  • Surfaces and Interfaces

Cite this