Extension of a full-wave layered interconnect simulator (UA-FWLIS) to handle lossy interconnects

Yi Cao, Zhaohui Zhu, Xing Wang, Steven L. Dvorak, John L. Prince

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

In this paper, we discuss the enhancement of a MoM-based Full-Wave Layered Interconnect Simulator (UA-FWLIS) so that it can handle conductor losses, By introducing an effective surface current and a surface impedance, the losses on the interconnects can be easily included in UA-FWLIS by adding an extra term to the reaction elements. Thus, the approach for analytically calculating the integrals in the reaction matrix, which uses readily computable ILMIs and residue theory, is still valid and the efficiency of UA-FWLIS can be retained. Comparing the S-parameter results from UA-FWLIS with those from Agilent Momentum validates the accuracy of the enhanced UA-FWLIS.

Original languageEnglish (US)
Title of host publicationProceedings - 9th IEEE Workshop on Signal Propagation on Interconnects, SPI 2005
Pages85-88
Number of pages4
StatePublished - Dec 1 2005
Event9th IEEE Workshop on Signal Propagation on Interconnects, SPI 2005 - Garmisch-Partenkirchen, Germany
Duration: May 10 2005May 13 2005

Publication series

NameProceedings - 9th IEEE Workshop on Signal Propagation on Interconnects, SPI 2005
Volume2005

Other

Other9th IEEE Workshop on Signal Propagation on Interconnects, SPI 2005
CountryGermany
CityGarmisch-Partenkirchen
Period5/10/055/13/05

ASJC Scopus subject areas

  • Engineering(all)

Fingerprint Dive into the research topics of 'Extension of a full-wave layered interconnect simulator (UA-FWLIS) to handle lossy interconnects'. Together they form a unique fingerprint.

  • Cite this

    Cao, Y., Zhu, Z., Wang, X., Dvorak, S. L., & Prince, J. L. (2005). Extension of a full-wave layered interconnect simulator (UA-FWLIS) to handle lossy interconnects. In Proceedings - 9th IEEE Workshop on Signal Propagation on Interconnects, SPI 2005 (pp. 85-88). [1500907] (Proceedings - 9th IEEE Workshop on Signal Propagation on Interconnects, SPI 2005; Vol. 2005).