Extraction of the hybrid phase-pole macromodel parameters using the matrix pencil method

Tao Hu; Steven L. Dvorak; John L. Prince

doi:10.1109/EPEP.2002.1057937

Extraction of the hybrid phase-pole macromodel parameters using the matrix pencil method

Tao Hu, Steven L. Dvorak, John L. Prince

Electrical and Computer Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

3 Scopus citations

Abstract

In this paper, the matrix pencil technique is used to extract the poles and residues for the Hybrid Phase-Pole Macromodel (HPPM) from simulated Triangle Impulse Response (TIR) data. The HPPM generation procedure is applied to example interconnects. The results are compared with a standard macromodel and with theoretical values.

Original language	English (US)
Title of host publication	Electrical Performance of Electronic Packaging, EPEP 2002
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	301-304
Number of pages	4
ISBN (Electronic)	0780374517
DOIs	https://doi.org/10.1109/EPEP.2002.1057937
State	Published - Jan 1 2002
Event	11th Topical Meeting on Electrical Performance of Electronic Packaging, EPEP 2002 - Monterey, United States Duration: Oct 21 2002 → Oct 23 2002

Publication series

Name	IEEE Topical Meeting on Electrical Performance of Electronic Packaging
Volume	2002-January

Other

Other	11th Topical Meeting on Electrical Performance of Electronic Packaging, EPEP 2002
Country	United States
City	Monterey
Period	10/21/02 → 10/23/02

ASJC Scopus subject areas

Electrical and Electronic Engineering
Condensed Matter Physics
Electronic, Optical and Magnetic Materials

Access to Document

10.1109/EPEP.2002.1057937

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Cite this

Hu, T., Dvorak, S. L., & Prince, J. L. (2002). Extraction of the hybrid phase-pole macromodel parameters using the matrix pencil method. In Electrical Performance of Electronic Packaging, EPEP 2002 (pp. 301-304). [1057937] (IEEE Topical Meeting on Electrical Performance of Electronic Packaging; Vol. 2002-January). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/EPEP.2002.1057937

Extraction of the hybrid phase-pole macromodel parameters using the matrix pencil method. / Hu, Tao; Dvorak, Steven L.; Prince, John L.

Electrical Performance of Electronic Packaging, EPEP 2002. Institute of Electrical and Electronics Engineers Inc., 2002. p. 301-304 1057937 (IEEE Topical Meeting on Electrical Performance of Electronic Packaging; Vol. 2002-January).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Hu, T, Dvorak, SL & Prince, JL 2002, Extraction of the hybrid phase-pole macromodel parameters using the matrix pencil method. in Electrical Performance of Electronic Packaging, EPEP 2002., 1057937, IEEE Topical Meeting on Electrical Performance of Electronic Packaging, vol. 2002-January, Institute of Electrical and Electronics Engineers Inc., pp. 301-304, 11th Topical Meeting on Electrical Performance of Electronic Packaging, EPEP 2002, Monterey, United States, 10/21/02. https://doi.org/10.1109/EPEP.2002.1057937

Hu T, Dvorak SL, Prince JL. Extraction of the hybrid phase-pole macromodel parameters using the matrix pencil method. In Electrical Performance of Electronic Packaging, EPEP 2002. Institute of Electrical and Electronics Engineers Inc. 2002. p. 301-304. 1057937. (IEEE Topical Meeting on Electrical Performance of Electronic Packaging). https://doi.org/10.1109/EPEP.2002.1057937

@inproceedings{1103921f7a5849dcab074d6acbfa8df6,

title = "Extraction of the hybrid phase-pole macromodel parameters using the matrix pencil method",

abstract = "In this paper, the matrix pencil technique is used to extract the poles and residues for the Hybrid Phase-Pole Macromodel (HPPM) from simulated Triangle Impulse Response (TIR) data. The HPPM generation procedure is applied to example interconnects. The results are compared with a standard macromodel and with theoretical values.",

author = "Tao Hu and Dvorak, {Steven L.} and Prince, {John L.}",

year = "2002",

month = jan,

day = "1",

doi = "10.1109/EPEP.2002.1057937",

language = "English (US)",

series = "IEEE Topical Meeting on Electrical Performance of Electronic Packaging",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

pages = "301--304",

booktitle = "Electrical Performance of Electronic Packaging, EPEP 2002",

note = "11th Topical Meeting on Electrical Performance of Electronic Packaging, EPEP 2002 ; Conference date: 21-10-2002 Through 23-10-2002",

}

TY - GEN

T1 - Extraction of the hybrid phase-pole macromodel parameters using the matrix pencil method

AU - Hu, Tao

AU - Dvorak, Steven L.

AU - Prince, John L.

PY - 2002/1/1

Y1 - 2002/1/1

N2 - In this paper, the matrix pencil technique is used to extract the poles and residues for the Hybrid Phase-Pole Macromodel (HPPM) from simulated Triangle Impulse Response (TIR) data. The HPPM generation procedure is applied to example interconnects. The results are compared with a standard macromodel and with theoretical values.

AB - In this paper, the matrix pencil technique is used to extract the poles and residues for the Hybrid Phase-Pole Macromodel (HPPM) from simulated Triangle Impulse Response (TIR) data. The HPPM generation procedure is applied to example interconnects. The results are compared with a standard macromodel and with theoretical values.

UR - http://www.scopus.com/inward/record.url?scp=9244259567&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=9244259567&partnerID=8YFLogxK

U2 - 10.1109/EPEP.2002.1057937

DO - 10.1109/EPEP.2002.1057937

M3 - Conference contribution

AN - SCOPUS:9244259567

T3 - IEEE Topical Meeting on Electrical Performance of Electronic Packaging

SP - 301

EP - 304

BT - Electrical Performance of Electronic Packaging, EPEP 2002

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 11th Topical Meeting on Electrical Performance of Electronic Packaging, EPEP 2002

Y2 - 21 October 2002 through 23 October 2002

ER -